23-0518-00

Termination:	Solder
Contact Resistance:	--
Current Rating:	3A
Material Flammability Rating:	UL94 V-0
Termination Post Length:	0.046" (1.17mm)
Operating Temperature:	--
Housing Material:	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post:	Brass
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Finish - Post:	Tin
Pitch - Post:	0.100" (2.54mm)
Series:	518
Features:	Open Frame
Mounting Type:	Surface Mount
Contact Material - Mating:	Beryllium Copper
Contact Finish Thickness - Mating:	10.0µin (0.25µm)
Contact Finish - Mating:	Gold
Pitch - Mating:	0.100" (2.54mm)
Number of Positions or Pins (Grid):	23 (1 x 23)
Type:	SIP
Part Status:	Active
Packaging:	Bulk

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Sockets for ICs, Transistors IntroductionSockets for ICs (Integrated Circuits), transistors, and other related components come in a variety of shapes, sizes, and materials. Socket design is critical in order to ensure reliable connections and reduce board real estate. IC sockets allow pinned components to be inserted and extracted without mechanically stressing components or compromising connection integrity. Types of IC SocketsThere are many types of IC sockets depending on the application. The most popular include:

• ZIF (Zero Insertion Force) sockets: This socket type provides the most secure connection. It features a lever that allows the pins to be locked in place.
• PIGGYBACK: This type of socket is used when a PIN has to be routed through the chip socket. The shorter PIN is kept inside the socket and there is a hole provided along its sides for cable routing.
• DIP (Dual In-line Package) sockets: DIP sockets are designed to fit onto printed circuit boards and are the most common type of socket for non- Surface Mount components.
• PGA (Pin Grid Array) sockets: PGA sockets are very similar to DIP sockets but feature pins that are arranged in Linear arrays, instead of circular rows. These sockets are designed to reduce board real estate while adding additional contact points.
• LGA (Land Grid Array) sockets: LGA sockets are designed to provide not just electrical but thermal connectivity as well. These sockets feature a raised surface with multiple pads that make contact with the component.
• FLIP TOP: This type of socket features a flip-top cover that provides access to the component without having to remove it from the board.

Working PrincipleThe socket works by providing a secure connection between the chip and the printed circuit board. The pins of the chip are inserted into the socket and secured with either screws or clamps. The connection is then maintained by the solder applied to the pins. This solder is a melting alloy which bonds the metal pin of the chip and board together.The IC socket provides a secure connection for two reasons:

• The soldering process creates a tight bond between the chip and board.
• The socket prevents physical damage from board stress, as it acts as a buffer between the chip and printed circuit board.

The installation of the IC socket also allows for efficient board layout, as components can be placed in whatever configuration is deemed most efficient, without having to worry about the connection of each component. ConclusionSockets for ICs, transistors, and other related components are designed to provide a secure connection between a chip and a printed circuit board while providing space efficiency and allowing for efficient board layout. IC sockets come in a variety of shapes, sizes, and materials and are important for ensuring reliable connections between integrated circuits.

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