235-3019-52-0602

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Sockets for ICs, transistors, and other electronic components are generally used to make connections between the components and the printed circuit boards. The sockets are either soldered onto the board or mounted into the board using a variety of mounting methods. Some sockets are even integrated directly into the board as part of the design.

235-3019-52-0602 Application Field and Working Principle

The 235-3019-52-0602 is a socket for integrated circuit (IC) or transistor which is designed to fit in a single socketed DIP package with two rows of pins spaced at a 0.6-inch pitch. The socket provides a reliable connection to the printed circuit board, and allows for pin inspection and removal of components without soldering. It is typically used for general-purpose logic or line-controlled logic or interface circuits.

The 235-3019-52-0602 socket consists of two rows of pins spaced at 0.6” pitch, which sits atop a platform with support legs that provide stability and structural integrity. The pins are enclosed in an insulating molded epoxy material, and the legs are made of a thin sheet of stainless steel. The contact portion of the pins are tinned, so that when properly secured, a reliable electrical connection is made between the IC and the printed circuit board. The socket also includes a clamping mechanism and a pick-and-place assembly for easy application, removal, and re-application. The clamping mechanism ensures a secure contact between the socket and the circuit board and prevents the IC from being dislodged.

The 235-3019-52-0602 socket is reliable and durable, and can withstand repeated cycles of insertion and removal, making it well suited for use with multiple ICs. Additionally, the socket design allows it to be used with all types of packages, including ICs, transistors, and other electronic components.

In conclusion, the 235-3019-52-0602 is a reliable and durable socket for integrated circuits (ICs) and transistors which provides a robust and secure connection between the board and the IC. Its design allows for easy application, removal and re-application. It is also suitable for use with multiple ICs, as it can withstand multiple insertion and removal cycles.

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