24-0511-10 Allicdata Electronics
Allicdata Part #:

24-0511-10-ND

Manufacturer Part#:

24-0511-10

Price: $ 4.59
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN SOCKET SIP 24POS TIN
More Detail: N/A
DataSheet: 24-0511-10 datasheet24-0511-10 Datasheet/PDF
Quantity: 1000
17 +: $ 4.17171
Stock 1000Can Ship Immediately
$ 4.59
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.150" (3.81mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 511
Features: --
Mounting Type: Through Hole
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 24 (1 x 24)
Type: SIP
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, TransistorsIntegrated circuits, transistors, LEDs, and other electronic components need to be connected to circuits in order for them to function properly. The primary way of doing this is with sockets. Sockets are designed to securely accept a particular type of integrated circuit, transistor, and/or LED. Some sockets are designed for a single type of component, while others are designed to accept more than one type. Sockets are typically designed to fit standardized integrated circuits, transistors, and other components with the same size and pin-out (or lead configuration). Such standardization simplifies and reduces cost in both the development and production phases of a product. Sockets also provide a more robust connection than can be made by soldering an integrated circuit directly to a board. This protects both the component and the circuit board from potential damage. There are several types of sockets, differentiated by their pin-out style, pin count, and connection method. Common types of pin-outs include: DIP, SOIC, SSOP, PLCC, QFP, TQFP, BGA, and TXM. Each type of pin-out has its own corresponding type of socket that can accept that type of pin-out. The most common connection type for sockets is soldering. This is the process of creating a physical and electrical connection between two separate components by melting a metal alloy known as solder. The resulting connection is known as a soldered joint. Other connection types such as crimping and zero insertion force can be used in some applications. The primary application field for sockets is in the interconnected device (or "IC") assemblies used in most electronic products. These assemblies include printed circuit boards (PCBs), hybrid integrated circuits (Hybrids) and multi-chip modules (MCMs). Since there are no individual components on these assemblies, there is no need to solder each component individually. Instead, the individual components are inserted into sockets, and the sockets are soldered to the PCB. The sockets provide a secure connection for each component and allow them to be easily replaced if necessary. Sockets also have other applications such as prototyping, development, and testing. When developing a new product, it may be necessary to make several revisions to the design. With sockets, a prototype circuit board can be quickly assembled and tested. If changes are necessary, the components can easily be replaced or rearranged. Similarly, during debugging and testing, sockets allow for quick and easy replacement of faulty components. In summary, sockets are used to securely accept integrated circuits, transistors, and other electronic components. They provide a more robust and reliable connection than soldering and are commonly used in IC assemblies. Sockets are also used in prototyping, development, and testing applications.

The specific data is subject to PDF, and the above content is for reference

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