24-3503-21

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Sockets for ICs, transistors, and other electronic components have long been essential to the proper functioning of various devices and systems. With the emergence of highly integrated systems, having a socket to easily connect and disconnect integrated circuits has become even more important. The 24-3503-21 socket is one such product that has found wide acceptance in a number of applications. This article will give a brief overview of the 24-3503-21 socket and its applications and explain the working principle behind it.

The 24-3503-21 socket is a surface mount socket designed to work with ball grid array (BGA) packages. It is a dual-sided component with a top and bottom side. It can accommodate 8, 16, and 20-pin packages, but is primarily used with 8-pin packages. The top side of the socket is fitted with a metal contact that attaches to the BGA package, while the bottom side is designed to facilitate the physical connection between the BGA package and the circuit board. The socket also features a locking mechanism that prevents the BGA package from being pulled out.

The 24-3503-21 socket is primarily used in consumer electrical devices such as smart phones, tablets, laptops, and other related electronic devices. It is also used in industrial applications such as automotive, aviation, and medical devices. In particular, the socket is used to integrate ICs into mobile devices, allowing for faster performance, more efficient power consumption, and improved stability. Its small size and versatility also make it useful in miniature circuit design. The 24-3503-21 socket is also a widely used component in field-programmable gate arrays (FPGAs), which are used to program custom logic circuitry.

The 24-3503-21 socket is highly reliable, durable, and efficient. It features a high contact force that ensures good electrical contact between the BGA package and the circuit board. It also features a high temperature tolerance, allowing it to withstand variations in temperature and still maintain good contact with the BGA package. Additionally, its low profile and slim design make it ideal for portable applications.

The working principle behind the 24-3503-21 socket is relatively simple. The metal contact on the top side of the socket is designed to connect to the underside of the BGA package, while the bottom side of the socket is designed to fit into a specially designed hole on the circuit board. Once the socket is in place, it makes an electrical connection between the BGA package and the circuit board. The locking mechanism provides additional stability and prevents the BGA package from being pulled out. The contact force applied by the metal contact ensures a strong and reliable connection between the BGA package and the circuit board.

In conclusion, the 24-3503-21 socket is a highly effective surface-mount component used in a wide range of applications. It is a reliable, durable, and efficient choice for connecting BGA packages to circuit boards. Its low profile and slim design make it perfect for integrating into miniature circuit designs. Additionally, its high contact force and locking mechanism ensure a secure and reliable connection. The simple working principle behind this socket makes it easy to use and understand, making it an ideal choice for applications that require a dependable connection between BGA packages and circuit boards.

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