24-6556-40 Allicdata Electronics
Allicdata Part #:

24-6556-40-ND

Manufacturer Part#:

24-6556-40

Price: $ 16.77
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 24POS GOLD
More Detail: N/A
DataSheet: 24-6556-40 datasheet24-6556-40 Datasheet/PDF
Quantity: 1000
4 +: $ 15.09170
Stock 1000Can Ship Immediately
$ 16.77
Specifications
Series: 6556
Packaging: Bulk 
Part Status: Active
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder Cup
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: --
Termination Post Length: 0.180" (4.57mm)
Material Flammability Rating: UL94 V-0
Current Rating: 3A
Contact Resistance: --
Description

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Sockets for ICs, transistors, and other electronic components are ubiquitous in today’s electronic circuitry. The 24-6556-40 socket is a specialized type of device used for certain applications. This article provides an overview of the 24-6556-40 socket, including its common applications and the working principle behind this simple, yet important, mechanical device.

The 24-6556-40 socket is a type of surface-mount device (SMD) that allows users to readily and securely connect IC chips and other components to a PCB. It is generally used in high-speed applications, such as those that involve networking or communication protocols. The 24-6556-40 socket is designed to be used in tight spaces and can fit into package sizes as small as 0.5 mm pitch. The socket leverages a polyamide isolator to secure the IC chip to the PCB, ensuring efficient thermal and electrical contact between the two.

The 24-6556-40 socket is constructed with a flexible zinc alloy frame. The isolator is designed with wedge-shaped projections that fit snugly into the slots of the socket, providing an excellent fit. The socket also features two metal spring retainers which hold the chip in place against the isolator, while the isolator itself is seated firmly against the PCB. This provides the dual function of providing stable electrical contact as well as dissipating heat away from the chip.

In terms of applications, the 24-6556-40 socket is used in a wide variety of commercial and consumer electronics products, including communication and networking equipment, mobile phones, tablets, and other consumer electronics. It is also utilized in automotive, medical, and industrial electronics systems. The primary function of this socket is to provide an efficient way to connect IC chips to PCBs, allowing for rapid data transmission and efficient thermal management.

The working principle of the 24-6556-40 socket is fairly straightforward. When an IC chip is inserted into the socket, the isolator is pushed into the slots of the zinc alloy frame. This action causes the spring retainers to engage with the isolator, holding it in place. As the chip is pressed into the isolator, the frame compresses slightly, ensuring an ideal fit between the isolator and the chip. This enables reliable contact between the IC chip and the PCB, facilitating efficient data transmission and efficient thermal management.

In conclusion, the 24-6556-40 socket is an important type of surface-mount device used for connecting IC chips to PCBs in a range of products, from networking gear and mobile phones to medical and automotive electronics. This socket is designed with a flexible zinc alloy frame and a polyamide isolator that securely fits into the frame and provides efficient thermal and electrical contact between the IC chip and PCB. The 24-6556-40 socket is an extremely useful and versatile device that is used in many different types of electronics products.

The specific data is subject to PDF, and the above content is for reference

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