24-6574-11

Termination:	Solder
Contact Resistance:	--
Current Rating:	1A
Material Flammability Rating:	UL94 V-0
Termination Post Length:	0.110" (2.78mm)
Operating Temperature:	--
Housing Material:	Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post:	Beryllium Copper
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Finish - Post:	Tin
Pitch - Post:	0.100" (2.54mm)
Series:	57
Features:	Closed Frame
Mounting Type:	Through Hole
Contact Material - Mating:	Beryllium Copper
Contact Finish Thickness - Mating:	200.0µin (5.08µm)
Contact Finish - Mating:	Tin
Pitch - Mating:	0.100" (2.54mm)
Number of Positions or Pins (Grid):	24 (2 x 12)
Type:	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Part Status:	Active
Packaging:	Bulk

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24-6574-11 Application Field and Working Principle

Sockets, also known as integrated circuits (ICs) and transistors, are an essential component of any electronic device in today’s world. They are used in a variety of devices such as computers, cell phones, radios, and televisions. The 24-6574-11 Socket is a common socket used in many applications. The socket is a two-contact, low-profile surface mounting component, designed to facilitate the placement of surface-mount devices on to printed circuit boards.

Application Fields

The 24-6574-11 socket has multiple uses in a variety of applications. It is commonly used in industrial, automotive, and avionic applications for connecting components such as sensors, transducers, and transformers. In addition, the socket is also suitable for medical devices, audio applications, and low-power electronics.

Working Principle

The 24-6574-11 socket has a simple and effective working principle. The socket consists of two contact pads that are connected to a substrate. The contact pads provide the electrical connection between the components on the substrate and the external device. The contact pads are made of a highly conductive material such as copper or aluminium. A conductive polymer is then applied to the underside of the contact pads which forms a layer of insulation between the contact pads and the substrate. This layer of insulation prevents any conductive material that can cause a short circuit from coming into contact with the contact pads.When the component is attached to the socket, the contact pads on the socket make electrical contact with the component and the electrical current is transferred between them. The current then flows through the contact pads and the conductive polymer layer to the substrate where the component is mounted. This completes the electrical connection between the external device and the component.

Advantages of 24-6574-11

The 24-6574-11 socket has a number of advantages over other types of sockets. Firstly, it is a two-contact socket and therefore requires less space on the printed circuit board. This makes it suitable for applications where space is limited. Secondly, the socket is relatively low profile and the contact pads are recessed. This makes the socket less susceptible to mechanical stress and provides better protection for the components which are connected to it. Finally, the conductive polymer layer protects the contact pads from shorts caused by conductive materials, which ensures reliable electrical connections.

Conclusion

The 24-6574-11 socket is a widely used two-contact surface-mountable socket that is suitable for a variety of applications. It offers a number of advantages over other types of sockets, including its small size, low profile design, and protection from short circuits. The socket is simple to install and provides a reliable connection between components and the external device.

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