
Allicdata Part #: | 24-8770-310C-ND |
Manufacturer Part#: |
24-8770-310C |
Price: | $ 9.02 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aries Electronics |
Short Description: | CONN IC DIP SOCKET 24POS GOLD |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
8 +: | $ 8.20260 |
Termination: | Solder |
Contact Resistance: | -- |
Current Rating: | 3A |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.140" (3.56mm) |
Operating Temperature: | -55°C ~ 105°C |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Contact Material - Post: | Brass |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Finish - Post: | Gold |
Pitch - Post: | 0.100" (2.54mm) |
Series: | 8 |
Features: | Closed Frame, Elevated |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 24 (2 x 12) |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Part Status: | Active |
Packaging: | Bulk |
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Sockets for ICs, Transistors, are essential components in any electronics project. The 24-8770-310C socket is a popular choice for many circuits, both commercial and hobbyist. It is an economical, yet accurate and reliable component for circuits ranging from simple home hobby projects to more complex commercial projects. In this article, let’s explore the 24-8770-310C socket’s application field and working principle.
Application Fields
The 24-8770-310C socket is often used in electronics projects, such as amplifiers, cell phone chargers, automotive systems, industrial systems, and more. A variety of circuits can be accommodated depending on the requirements of the project. The 24-8770-310C socket is capable of handling current up to 10A and provides both high accuracy and reliability. The socket is also resistant to heat, vibration, moisture, and humidity. Furthermore, it has a low profile design and is well-suited for space-conscious projects.
Working Principle
The 24-8770-310C socket is designed to accept dual-in-line material packages (DIPs). DIPs are plastic packages in which one or more discrete electronic components are encased in resin. The package is designed to fit into a socket which contains two parallel rows of pins. When the DIP is placed into the socket, the small noses on the plastic package interact with two slots located in the center of the socket. This ensures that the component is held in place without having to rely on friction alone. This method of connection is known as ZIF (Zero Insertion Force) or non-insulative.
The DIP is then connected to the circuit via the two rows of pins, allowing current to flow between the component and the circuit board. The 24-8770-310C socket is designed to be able to securely connect the package to the board despite excessive vibration or shock, ensuring a reliable connection. Furthermore, the socket is designed to reduce the risk of electrical shorts by providing insulation between the two signal pins.
Advantages of 24-8770-310C Socket
The 24-8770-310C socket has a number of advantages compared to other sockets. Its low profile design allows for use in space-constrained projects. Furthermore, its ability to handle currents of up to 10A makes it well-suited for more complex electronic circuits. It has a wide temperature range, allowing for use in extreme conditions. Finally, it is extremely reliable, featuring zero insertion force (ZIF) connections and insulation between signal pins to reduce the chance of electrical shorts.
Conclusion
The 24-8770-310C socket is a popular choice for many electronics projects for its accuracy, reliability, and performance. It is capable of handling currents up to 10A and is resistant to vibration, heat, humidity, and extremes in temperature. Furthermore, its low profile design and zero insertion force (ZIF) connections make it an ideal choice for space-constrained projects. For these reasons, the 24-8770-310C socket is an ideal choice for a wide variety of electronics projects.
The specific data is subject to PDF, and the above content is for reference
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