24-8900-610C Allicdata Electronics
Allicdata Part #:

24-8900-610C-ND

Manufacturer Part#:

24-8900-610C

Price: $ 8.85
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 24POS GOLD
More Detail: N/A
DataSheet: 24-8900-610C datasheet24-8900-610C Datasheet/PDF
Quantity: 1000
8 +: $ 8.03880
Stock 1000Can Ship Immediately
$ 8.85
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.140" (3.56mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 8
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

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Sockets for ICs, Transistors

A 24-8900-610C socket is designed to support integrated circuits (IC) or transistors. It is particularly suited for PCB boards used in high speed and high temperature environments, such as telecommunications and medical devices. Understanding how this socket works and its application field can help you to understand how the device can be used in various systems.

Design of the Socket

The 24-8900-610C socket is a pin-grid array (PGA) socket. It has a total of 624 pins. The pins are set in a configured array to ensure reliable I/O connections. The pins are arranged in a 24 x 24 pattern, or nine rows and nine columns of pins. The pins are held securely in place using a press-fit technology to prevent premature disengagement.This socket is intended for use with a variety of ICs and known as a versatile device. It supports unipolar logic ICs, as well as digital, dual-state, analog, and digital/analog ICs with different pin sizes. The socket also supports both leaded and lead-free versions of ICs, transistors, and other active components.

Materials and Construction

The 24-8900-610C socket is made using high-performance materials such as FR-4 epoxy resin. The insulator is manufactured with gold contacts. The contacts are designed to be durable while providing reliable electrical connection. The epoxy construction helps to reduce signal loss and allows for higher reliability.

Performance Specifications and Connections

The 24-8900-610C socket has a signal transmission of 5 GHz. It also features impedance control of 100-150 ohms (between pins) and 200-300 ohms (between rows). The socket is also designed to be resistant to high temperatures up to 105°C.

Applications

The 24-8900-610C socket is ideal for use in PCBs found in telecommunications and medical devices, as well as other high temperature and high speed applications. This socket is commonly used in embedded systems, instruments, and control devices. It is also used in the aerospace and automotive industries for their advanced electronics.

Working Principle

The 24-8900-610C socket uses a press-fit technique to securely hold pins in place. This technique solves the difficult issue of unwanted signal variations and over time deterioration while still maintaining reliable connections. The pins are inserted into a round recess and then held in place using a press-fit technology. This ensures that the pins remain in contact with the board and do not disengage prematurely.

Conclusion

The 24-8900-610C socket is an innovative socket designed for use in high speed and high temperature applications. It is a versatile device that can support various ICs, transistors, and other components. This socket is designed to offer reliable connections while providing impedance control and signal transmission rates up to 5 GHz. With its durable construction and insulation, it is ideal for a variety of applications, from embedded systems to aircraft and automotive electronics.

The specific data is subject to PDF, and the above content is for reference

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