| Allicdata Part #: | 26-822-90C-ND |
| Manufacturer Part#: |
26-822-90C |
| Price: | $ 6.86 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Aries Electronics |
| Short Description: | CONN IC DIP SOCKET 26POS GOLD |
| More Detail: | N/A |
| DataSheet: | 26-822-90C Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.23574 |
| Termination: | Solder |
| Contact Resistance: | -- |
| Current Rating: | 3A |
| Material Flammability Rating: | UL94 V-0 |
| Termination Post Length: | 0.140" (3.56mm) |
| Operating Temperature: | -55°C ~ 105°C |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Material - Post: | Brass |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Finish - Post: | Tin |
| Pitch - Post: | 0.100" (2.54mm) |
| Series: | Vertisockets™ 800 |
| Features: | Closed Frame |
| Mounting Type: | Through Hole, Right Angle, Horizontal |
| Contact Material - Mating: | Beryllium Copper |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Finish - Mating: | Gold |
| Pitch - Mating: | 0.100" (2.54mm) |
| Number of Positions or Pins (Grid): | 26 (2 x 13) |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Part Status: | Active |
| Packaging: | Bulk |
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Sockets for ICs and Transistors are a very important part of interconnected circuitry. Enhancing the functionality of these devices, 26-822-90C is a socket that has gained quite a bit of popularity in the modern electronics marketplace for its reliable performance and robust features. This article will explore the application fields and working principle of 26-822-90C sockets.
Application Fields
Thanks to its versatile capabilities, 26-822-90C sockets are primarily used for the installation of memory chips, microprocessors, TTLs, NANDs, logic components, and transistors. They are also effectively used in the distributed computing environment for large scale data storage and data processing.26-822-90C sockets are commonly used for testing and debugging purposes for circuit boards, allowing engineers to quickly inspect the functionality of their designs and make necessary adjustments. Additionally, 26-822-90C sockets are used in aerospace, automotive, and industrial applications as well.
Working Principle
26-822-90C sockets feature an array of contacts which form a contact array, allowing chips and transistors to be securely held in place during testing. By connecting one socket to another, these contact arrays enable a quick and reliable connection between integrated circuit (IC) chips, transistors, or other components and a circuit board. To form this connection, each contact in the array contacts and makes electrical contact with its respective component or board contact. This contact array or system, along with the contact material employed, enables 26-822-90C sockets to support high-density connections between components and boards.
In addition to providing a reliable way of connecting components and boards, 26-822-90C sockets also boast increased electrical and thermal performance, thanks to the contact material employed. This performance plays a major role in applications that require a high level of accuracy, as it helps to reduce the resistance of components, thereby improving accuracy and speed. Furthermore, the ability to support a high number of contacts while occupying a small area allows various items to be connected without wasting too much space.
The socket’s design also minimizes installation time and provides a secure connection that will remain intact despite shock, vibration, and temperature fluctuations. It boasts a wide temperature range, allowing it to be used in extreme heat or cold and high-altitude applications. It is also UL listed, meeting the industry\'s safety standards.
Conclusion
26-822-90C sockets are a reliable and robust means of connecting components and boards. By offering a wide temperature range, high-density contact array, and improved thermal and electrical performance, these sockets are highly versatile and can be used in a variety of applications including distributed computing, aerospace, automotive, and industrial applications.
The specific data is subject to PDF, and the above content is for reference
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26-822-90C Datasheet/PDF