Allicdata Part #: | 28-3554-16-ND |
Manufacturer Part#: |
28-3554-16 |
Price: | $ 25.83 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aries Electronics |
Short Description: | CONN IC DIP SOCKET ZIF 24POS |
More Detail: | N/A |
DataSheet: | 28-3554-16 Datasheet/PDF |
Quantity: | 1000 |
9 +: | $ 23.24700 |
Termination: | Solder |
Contact Resistance: | -- |
Current Rating: | 1A |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.110" (2.78mm) |
Operating Temperature: | -- |
Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Contact Material - Post: | Beryllium Copper |
Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
Contact Finish - Post: | Nickel Boron |
Pitch - Post: | 0.100" (2.54mm) |
Series: | 55 |
Features: | Closed Frame |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
Contact Finish - Mating: | Nickel Boron |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 24 (2 x 12) |
Type: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
Part Status: | Active |
Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The 28-3554-16 is a type of socket for integrated circuits (ICs), transistors, and other types of components. It allows for quick and easy installation of components onto printed circuit boards (PCBs) for higher levels of productivity. It can also provide high levels of electrical connection, making it well suited for industrial applications.
The 28-3554-16 socket is a ZIF socket, or zero insertion force socket, meaning that no additional pressure or force is required to insert components into the socket. This level of ease of connection is highly desirable in many applications and can help reduce assembly costs. It is designed for fast, accurate, and easy placement of components.
The 28-3554-16 socket has an array configuration, which is extremely beneficial for saving board space and increasing assembly efficiency. It is an extremely low profile, surface mounted socket, which is ideal for applications where board space is limited. It is also designed to reduce crosstalk and allow for improved signal integrity.
The 28-3554-16 socket is designed to meet both industrial and military standards, concurring with CMOS, DIP, and LGA components. Its durability ensures reliable performance in a wide range of applications.
The 28-3554-16 socket is a reliable and stable connection solution that is suitable for a variety of applications. It can be used for prototyping, diagnostics, programming, test and measurement, and production applications. It can also be used in automotive and aerospace applications, as well as in consumer electronics.
The 28-3554-16 socket is constructed from a high temperature thermoplastic material, which ensures its durability and reliability in high temperature environments. It also provides excellent protection against EMI/RFI interference and reduces contact resistance. This socket has liquid crystal polymer (LCP) termination on the interconnect pins, which provides robust contact performance, allowing for a stable electrical connection.
The 28-3554-16 socket has a gold plating on the contact surface of the interconnect pins, which greatly enhances reliability and prevents contact oxidation. This allows the socket to be used in harsh environments and for long term applications.
The 28-3554-16 socket utilizes a simple push-push latch mechanism, which makes it easy to insert and remove components. It also has an industry-standard pinout configuration, allowing it to be used in almost any application. Additionally, its low insertion and extraction forces make it well suited for hand-held operations.
In conclusion, the 28-3554-16 socket is an excellent solution for high speed, reliable, and durable electrical connection. It is well suited for a wide range of applications such as industrial, automotive, aerospace, and consumer electronics. Its array configuration allows for efficient board space usage, while its gold plated contact surface ensures reliable performance and reduces contact oxidation. Furthermore, its simple push-push latch mechanism makes for easy and convenient connection and removal of components.
The specific data is subject to PDF, and the above content is for reference
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