Allicdata Part #: | 28-6556-20-ND |
Manufacturer Part#: |
28-6556-20 |
Price: | $ 8.83 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aries Electronics |
Short Description: | CONN IC DIP SOCKET 28POS GOLD |
More Detail: | N/A |
DataSheet: | 28-6556-20 Datasheet/PDF |
Quantity: | 1000 |
8 +: | $ 7.95060 |
Termination: | Wire Wrap |
Contact Resistance: | -- |
Current Rating: | 3A |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.283" (7.19mm) |
Operating Temperature: | -- |
Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Contact Material - Post: | Brass |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Finish - Post: | Tin |
Pitch - Post: | 0.100" (2.54mm) |
Series: | 6556 |
Features: | Open Frame |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 28 (2 x 14) |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Part Status: | Active |
Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Sockets for ICs, Transistors are essential pieces of hardware used in the manufacture of advanced electronic components. They provide a secure, reliable and consistent connection point between the device and the substrate, allowing data transfer to occur without damaging any of the delicate components involved. The 28-6556-20 is a common socket for ICs, transistors, and other advanced electronic parts.
This particular socket features two 16-pin positions, arranged in a square pattern for easy identification and mounting when putting the device in place. It also has four additional pins that can be used for various purposes such as power, ground, or communications signals. The socket is designed for a low profile, making it ideal for tight spaces or installations where space is particularly limited. It is high-quality and offers excellent heat dissipation, making it a great choice for high-performance applications.
The 28-6556-20 socket is commonly used in a variety of applications, from industrial controls to consumer products. It is ideally suited for use in circuit boards, as it is designed to keep all of the contacts properly connected. Its small size allows it to be mounted in tight spaces and its large physical contact area ensures a strong, reliable connection.
The application field of the 28-6556-20 socket is wide-ranging. It can be used to support transistors, as well as a range of other ICs. Its low profile also makes it suitable for use in robotics and industrial automation applications. This socket works particularly well for high-power optoelectronics and can be used for the assembly of power circuitry, such as in power supplies.
The 28-6556-20 socket’s working principle is based on the electricity flow between the pins and the underlying substrate. The socket is designed to take input from the device and funnel the electrical signal through the pins to the substrate. This helps ensure a consistent and secure connection between the device and the substrate, enabling data to be transferred without damaging either. The socket also acts as an anchor, helping keep the device in place so it can properly interact with the substrate.
In addition, the 28-6556-20 socket is designed to manage heat dissipation. By routing the electrical signals through all of the pins directly to the substrate, the device is able to cool down faster and remain in the same operating temperature range. This helps ensure reliable performance in even the most demanding applications.
Ultimately, the 28-6556-20 socket is a reliable and secure option for connecting ICs, transistors, and other advanced electronic components. Its wide-ranging application field and its ability to manage heat dissipation make it an ideal choice for all sorts of applications. With its robust design and high-performance build, it can easily provide a consistent and reliable connection point between the device and the substrate.
The specific data is subject to PDF, and the above content is for reference
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