28-665000-00 Allicdata Electronics
Allicdata Part #:

28-665000-00-ND

Manufacturer Part#:

28-665000-00

Price: $ 9.19
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: SCK ADAPT 28P SOIC-W TO SOIC 0.6
More Detail: IC Socket Adapter SOIC-W To SOIC Surface Mount
DataSheet: 28-665000-00 datasheet28-665000-00 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
7 +: $ 8.35380
Stock 1000Can Ship Immediately
$ 9.19
Specifications
Series: Correct-A-Chip® 665000
Part Status: Active
Lead Free Status / RoHS Status: --
Convert From (Adapter End): SOIC-W
Moisture Sensitivity Level (MSL): --
Convert To (Adapter End): SOIC
Number of Pins: 28
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: --
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: --
Board Material: FR4 Epoxy Glass
Termination Post Length: 0.031" (0.80mm)
Material Flammability Rating: --
Features: --
Operating Temperature: --
Contact Material - Mating: --
Contact Material - Post: Brass
Contact Finish Thickness - Mating: --
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description

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Sockets for ICs, Transistors, and Adapters all play a significant role in the 28-665000-00 Application field. They are integrated circuit (IC) packages and adapters that are used in various types of multi-chip modules (MCMs) and thermally enhanced packages (TEPs). These types of packages can be used to reduce the size of ICs such as voltage regulators, memory controllers, wireless communications, and switch-mode power supplies. In this article, the working principle as well as the benefits of the 28-665000-00 Application Field will be discussed.

Working Principle

The 28-665000-00 IC Sockets are designed to provide the electrical connection for a specific package type, while also providing flexibility in how the ICs are mounted. This socket system consists of a plastic bottom part, a copper clad plate, and a plastic top part. The plastic bottom part is designed to provide protection to the ICs from external forces, while the copper clad plate provides the electrical connection between the IC package and the other components of the multi-chip module. The plastic top part is designed to hold the ICs in place, and allow for any customizations of the ICs.

When an IC is being mounted, the copper clad plates must first be set in place, followed by the plastic bottom part. The ICs are then placed into the plastic bottom part and held in place using the plastic top part. After the ICs are in the appropriate position, the contact pads on the copper clad plates are connected to the contact pads on the ICs. This connection is made via a soldering method. The connection between the copper clad plates and the ICs is then secured by adding additional plastic components to the system. This is done by attaching screws or metal clips to the plastic bottom part.

Once the ICs are secured in the system, they are then ready for use in the multi-chip module or the thermally enhanced packages. In these modules, the ICs are used for various application functions such as controlling power, data processing, or signal conditioning. With the help of these IC packages, a device is able to function and achieve its required performance.

Benefits

One of the main benefits of using 28-665000-00 Application Field is the reduction in the size of the device. This reduced size translates into a reduction in cost and space requirements on a device. This type of package also eliminates the need for a separate printed circuit board, as the electrical connection is made directly from the ICs. This reduces the cost of installing the components, and streamlines the time frame in which the module is assembled.

The 28-665000-00 Application Field also reduces the number of electrical connections that must be made. This is due to the standardized use of contact pads and terminals. These contact pads offer a much wider range of flexibility in terms of layout, and can accommodate various layouts for the ICs and other components. This reduces the amount of time that is typically needed to specify the layout of the components, and increases the rate of successful implementation of devices.

Finally, due to the simplified electrical connection offered by the 28-665000-00 Application Field, it can reduce the risk of electrical shorts and reduce the risk of failure in the device. This is due to the increased number of reliable connections being made between the ICs and the other components of the module. This improves the electrical performance of the device, and reduces the possibility of failure due to an electrical short.

Conclusion

In conclusion, the 28-665000-00 Application Field has multiple benefits that have led to its widespread use in the industry. Its small size and reduced cost help to reduce the cost of manufacturing devices, while its simplified electrical connection reduces the risk of electrical shorts and improves the performance of the device. The wide range of contact pads and terminals also reduce the amount of time needed for specifying the layout of components, cutting down on assembly time. This type of socket is an essential component in today\'s modern, multi-chip modules and thermally enhanced packages.

The specific data is subject to PDF, and the above content is for reference

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