Allicdata Part #: | 28-81250-610C-ND |
Manufacturer Part#: |
28-81250-610C |
Price: | $ 10.24 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aries Electronics |
Short Description: | CONN IC DIP SOCKET 28POS GOLD |
More Detail: | N/A |
DataSheet: | 28-81250-610C Datasheet/PDF |
Quantity: | 1000 |
7 +: | $ 9.31140 |
Series: | 8 |
Packaging: | Bulk |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 28 (2 x 14) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame, Elevated |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | -55°C ~ 105°C |
Termination Post Length: | 0.140" (3.56mm) |
Material Flammability Rating: | UL94 V-0 |
Current Rating: | 3A |
Contact Resistance: | -- |
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Sockets for ICs, Transistors
A 28-81250-610C socket is a type of interconnect device used to mount integrated circuits (ICs), transistors, and other components requiring a connection. The 28-81250-610C socket has a relatively streamlined design which makes it an ideal option for working with these components which need to be securely connected while maximizing ease of use. In this article, we\'ll cover the practical applications of the 28-81250-610C socket and its working principle.
Application Field
The 28-81250-610C socket is designed for use in larger circuit boards. It is typically used when the component is integral to the board, but can easily be removed and replaced at a later date if needed. By using a socket instead of soldering the component directly to the board, potential future repairs as well as changes to the circuit or components can be completed much faster and with much less effort. Furthermore, when dealing with sensitive components like ICs, sockets often provide better grip and security than soldering to the boards.
The 28-81250-610C socket is typically used in industrial, medical, and telecommunications applications. Its sturdy construction makes it great for connecting components that are subject to vibrations and knocks. Examples of use cases include automotive, factory automation, medical systems, aerospace, and consumer products. Its design also makes it great for prototyping and testing projects and can usually be mounted to boards relatively quickly and easily.
Working Principle
A 28-81250-610C socket works by creating a secure connection between the circuit board and the component to be connected. Its design allows for the component to ‘snap’ into the socket, securing it in place in order to make a good electrical contact. The socket is typically made of plastic and metal and may feature several raised pins in order to help position the component before it is securely snapped into the socket. Once it is snapped in, the component will retain its connection securely and will stand up to vibrations and knocks without becoming disconnected.
The 28-81250-610C socket is designed to safely and securely engage components with a minimum of effort. The key advantages of using this type of socket is that it enables components to be connected and disconnected quickly, securely, and reliably. Furthermore, it eliminates the need for soldering and thus the potential risk of damaging other board components while soldering.
Conclusion
In conclusion, the 28-81250-610C socket is a great option for quickly and securely connecting components such as ICs and transistors to larger circuit boards. It is typically used in industrial, medical, and telecommunications applications and is suitable for use in prototyping and testing projects. It provides a secure connection without the need for soldering and enables components to be easily and quickly connected and disconnected.
The specific data is subject to PDF, and the above content is for reference
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