Allicdata Part #: | ED90156-ND |
Manufacturer Part#: |
299-43-640-10-002000 |
Price: | $ 15.76 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Mill-Max Manufacturing Corp. |
Short Description: | CONN IC DIP SOCKET 40POS GOLD |
More Detail: | N/A |
DataSheet: | 299-43-640-10-002000 Datasheet/PDF |
Quantity: | 1000 |
50 +: | $ 14.17980 |
Termination: | Solder |
Contact Resistance: | -- |
Current Rating: | 3A |
Material Flammability Rating: | -- |
Termination Post Length: | 0.126" (3.20mm) |
Operating Temperature: | -55°C ~ 125°C |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Contact Material - Post: | Brass Alloy |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Finish - Post: | Tin |
Pitch - Post: | 0.100" (2.54mm) |
Series: | 299 |
Features: | Closed Frame |
Mounting Type: | Through Hole, Right Angle, Horizontal |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 40 (2 x 20) |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Part Status: | Active |
Packaging: | Tube |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The applications and working principles of sockets for ICs, transistors and other semiconductor devices has been a subject of considerable interest in recent years. Socket technology has been developed to provide an efficient way to connect electronic components, thus making it easier to connect/disconnect and make changes to circuits without the need to solder components together. The technology is applicable to any type of round pin devices, but is particularly attractive for use with ICs, transistors, and other semiconductor devices with up to 299-43-640-10-002000 pins.
In general, socket technology provides a set of sockets for ICs, transistors, or other semiconductor devices, with each socket containing several contacts. The connections are made by inserting the device into the socket until it locks into place. The contacts on the socket then make contact with the leads on the device, forming an electrical connection. The sockets are typically made of a dielectric material which also serves to protect the device from electrical shorts or any other type of damage.
The technology also provides a way to quickly and easily test new ICs, transistors, or semiconductor devices. By inserting the device into the socket and then connecting to the appropriate power supply, the user can quickly see if the device is working correctly. This saves time and money by allowing the user to more easily troubleshoot problems without the need to solder components together.
The main advantage of socket technology for ICs, transistors, and other semiconductor devices is its flexibility. It allows for connections between components of different sizes and shapes. This makes it easier to replace parts or add devices to the circuit without any problems. It is also less expensive when compared to traditional soldering methods, since it requires fewer components and less labor.
In addition to its flexibility, socket technology is also very easy to use. It requires no special tools or equipment, and the user only needs to insert the device into the socket to make it work. This saves time and money when compared to more complicated soldering procedures.
The technology itself also has some inherent advantages over other methods of connecting components. For example, using socket technology, ICs, transistors, and other semiconductor devices can be connected without having to use a heat source or solder paste. This reduces the risk of overheating and damaging the component during assembly.
In summary, socket technology for ICs, transistors, and other semiconductor devices is a very useful and proven technology that provides the user with a convenient way to make connections. It is a flexible and easy to use technology that eliminates the need for soldering components together. The technology also provides a way to quickly and easily test new ICs, transistors, or semiconductor devices.
The specific data is subject to PDF, and the above content is for reference
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