3-2013022-4 Allicdata Electronics

3-2013022-4 Connectors, Interconnects

Allicdata Part #:

3-2013022-4-ND

Manufacturer Part#:

3-2013022-4

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN SKT SODIMM 204POS SMD
More Detail: 204 Position SODIMM DDR3 SDRAM Socket Surface Moun...
DataSheet: 3-2013022-4 datasheet3-2013022-4 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tape & Reel (TR) 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Style: SODIMM
Number of Positions: 204
Memory Type: DDR3 SDRAM
Standards: --
Mounting Type: Surface Mount, 25° Angle
Features: Board Guide, Latches
Mounting Feature: Normal, Standard - Top
Contact Finish: Gold
Contact Finish Thickness: Flash
Description

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Inline module sockets are memory connectors that are typically used as part of a larger system. An inline module socket conducts signals between other components on a circuit board, usually for digital memory storage. Inline module sockets are often used to connect with cache memory chips, RAM, ROM, and Non-Volatile RAM (NVRAM).The 3-2013022-4 is a specific inline module socket that has a variety of applications. It is widely used in many electronic devices such as computers, cell phones, tablets, and other consumer electronic products. This module socket is typically used in applications where a high-performance, dependable interface is required. It has a number of features that make it ideal for a wide range of uses.The 3-2013022-4 is a pin grid array (PGA) socket that is slide-lockable. It consists of a mounting frame and a pluggable interface. The 3-2013022-4 includes a header and a socket casing, which both have metal alloy plating. This provides both stability and corrosion resistance to the pin grid array connection. The socket casing has a metal alloy plating for improved thermal dissipation and additional strength. The 3-2013022-4 socket also features anti-skid grooves to ensure secure mounting.TheHeader and the socket casing can be easily plugged in and out of the module. To use the socket, the electronic device\'s housing is then connected to the socket. Once connected, the module allows for the connection of any electronic components or circuits. The socket\'s electrical connections are designed to provide reliable performance and durability. It can support up to 36-pins, allowing for multiple signal connections.The interface of the 3-2013022-4 is designed to be compatible with a variety of interface configurations. The interface includes a contact block, 4 termination pins, and 4 geometries. The contact block consists of two contact rows and four contact pins, which fit into the interface of the socket. The 4 termination pins provide additional strength to the socket contact when used in longer sockets. The 4 geometries can be configured for three different types of applications: edge mount, surface mount and recessed mount.The 3-2013022-4 is widely used in applications such as high-performance memory systems, communication components, data acquisition systems, and high-speed networking systems. The module is capable of supporting high data rates while providing low electrical resistance and reduced noise levels. Additionally, the module has an integrated heat sink which helps to dissipate any excess heat that may be generated by the electrical signals. This ensures that the module can maintain its performance and integrity even under high load conditions.Overall, the 3-2013022-4 is an ideal memory connector for applications that demand high-performance, dependable interfaces. The socket\'s metal alloy plating and frame provide stability and corrosion resistance, while its contact block, 4 termination pins, and 4 geometries enable a variety of connection options. Additionally, the module has an integrated heat sink to protect against thermal damage. The 3-2013022-4 is widely used in applications such as memory systems, communication components, data acquisition systems, and high-speed networking systems.

The specific data is subject to PDF, and the above content is for reference

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