3021015 RF/IF and RFID

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RFI and EMI - Contacts, Fingerstock and Gaskets

The 3021015 application field and working principle for contacts, fingerstock and gaskets is related to the prevention of electromagnetic interference (EMI) and radio frequency interference (RFI). EMI involves the emission of electromagnetic radiation from one source, which is picked up by another source, to the point where it potentially can interfere with radio or TV reception or cause malfunction of certain electronic equipment.

RFI involves a similar but slightly different scenario. Radio frequencies, typically television or radio signals, are sent out from their source, picked up by the second source, interfering with radio or television reception or causing detectable problems in certain electronic devices. Both scenarios must be addressed when designing contacts, fingerstock and gaskets and other products which prevent the interference from one source to another.

The 3021015 application field and work principle for contacts, fingerstock and gaskets generally involves shielding, which is essentially material that surrounds and encases an electronic component or circuit, thus preventing the EMI or RFI from entering or leaving the area. The first step is to test the component or circuit for interference caused by either emitting or receiving electromagnetic radiation. There are a number of ways to do this, but the most popular are a low-profile Faraday cage test, high-profile low frequency and high-profile high frequency tests. Once any interference has been identified, the shielding material is then applied around the affected area. This is often done with conductive material, such as foam or metal.

The 3021015 application field and work principle for contacts, fingerstock and gaskets can also involve specific material, such as a Faraday cage material or a conductive absorbent material (CAM). Faraday cages are metal or non-metallic material that helps absorb EMI. They are typically made from metal, such as copper wire mesh, or fabric such as nylon-coated rubber or metal. Conductive absorbent materials are designed to absorb RFI in a particular frequency range. Common examples include polyrectangular, conductive rubber, or porcelain.

Aside from shielding, other methods of reducing EMI and RFI include the use of electromagnetic field or wave shielding, grounding, conduit, and power conditioners/filters. Shielding is often accomplished by using metal or other metal-like materials which have been treated to provide a permittivity of lower than 1.0. Grounding helps by providing a base reference of electrical current and is used to reduce or eliminate discrepancies between the various conductors of a circuit. Conduits and power conditioners/filters also help reduce the RFI or EMI by providing either short-term or long-term shielding for current flow.

The 3021015 application field and work principle for contacts, fingerstock and gaskets can also involve special techniques such as dielectric absorption or conduction. The dielectric absorption process requires a material to be placed between two conductors which have a dielectric charge between them. This creates a low impedance path for EMI or RFI to travel, reducing the amount that is transferred. Conduction is the process of providing a permittivity different than 1.0 in order to reduce the amount of EMI or RFI that is emitted.

In conclusion, the 3021015 application field and work principle for contacts, fingerstock and gaskets can involve a number of different methods and materials for reducing the EMI and RFI from one source to another. These can include shielding, grounding, and the use of specific materials, such as Faraday cages or conductive absorbent material. Additionally, techniques such as dielectric absorption or conduction can further reduce the amount of interference emitted from one source to another. As technology advances, the methods used to protect electronic equipment from EMI and RFI are becoming increasingly sophisticated and effective.

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