32-3551-11 Allicdata Electronics
Allicdata Part #:

32-3551-11-ND

Manufacturer Part#:

32-3551-11

Price: $ 9.36
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET ZIF 32POS GLD
More Detail: N/A
DataSheet: 32-3551-11 datasheet32-3551-11 Datasheet/PDF
Quantity: 1000
56 +: $ 8.50500
Stock 1000Can Ship Immediately
$ 9.36
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.110" (2.78mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: --
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 55
Features: Closed Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: --
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors

32-3551-11 is a high-performance test socket for integrated circuits (ICs), transistors, and other semiconductor components. It is designed to provide reliable mechanical connections for testing ICs with high-speed data rates and high density applications. The socket uses a flexible, low-profile design to minimize overall socket height while providing the most reliable electrical and thermal connections for the ICs.

Application Field and Working Principle

32-3551-11 is suitable for applications such as precision test and burn-in connections for ICs and semiconductor components. It is the optimal choice for high-speed IC testing and burn-in applications. The socket features gold-plated contacts over a PBT or PCT core material. This combination of material provides superior stability and thermal transfer capabilities that make it ideal for high-speed data transfer and power-on testing.

The design of the 32-3551-11 socket has a number of features that allow it to provide superior performance in high-speed data rate and high density applications. The socket features a large number of gold-plated contacts that allow for reliable electrical connections with high-speed data transfer rates. The contacts are designed with a low-profile design that minimizes their overall height and allows for minimal signal distortion. The flexible PBT/PCT material that the contacts are made out of provides superior solderability and thermal transfer for higher hot-plugging capabilities.

The 32-3551-11 socket also features a low-impedance spring contact design. This design minimizes contact resistance allowing for improved signal integrity and minimal skin effects. This design also eliminates the need for additional connection materials and improves heat dissipation in high temperature environments. Finally, the socket also includes an optional latch-lock feature that ensures a secure connection and prevents inadvertent disconnection.

The 32-3551-11 socket is a reliable and cost-effective solution for high-speed IC testing and burn-in applications. Its superior electrical characteristics, low-profile design, and flexible materials provide reliable mechanical connections for testing ICs with high-speed data rates and high density applications.

The specific data is subject to PDF, and the above content is for reference

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