Insulation Color:	Black
Contact Finish Thickness - Post:	10.0µin (0.25µm)
Contact Material:	Beryllium Copper
Contact Shape:	Circular
Insulation Material:	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Applications:	--
Voltage Rating:	--
Current Rating:	3A
Features:	--
Ingress Protection:	--
Mated Stacking Heights:	--
Contact Finish - Post:	Gold
Material Flammability Rating:	--
Operating Temperature:	-55°C ~ 125°C
Contact Length - Post:	0.630" (16.00mm)
Insulation Height:	0.110" (2.79mm)
Series:	324
Contact Finish Thickness - Mating:	10.0µin (0.25µm)
Contact Finish - Mating:	Gold
Fastening Type:	Push-Pull
Termination:	Wire Wrap
Mounting Type:	Through Hole
Row Spacing - Mating:	--
Number of Rows:	1
Pitch - Mating:	0.100" (2.54mm)
Number of Positions Loaded:	All
Number of Positions:	49
Style:	Board to Board
Contact Type:	Female Socket
Connector Type:	Receptacle
Part Status:	Active
Packaging:	Bulk

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Sockets for ICs, Transistors

Sockets for ICs (Integrated Circuits) and transistors enable secure connectivity between an electronic circuit and the device it controls or is powered by. A socket, also known as an Integrated Circuit (IC) socket, is a physical interface device used to attach an IC to a printed circuit board (PCB). This provides a secure connection and reliable power supply for components within the circuit.Sockets provide data paths for both the input and output signals of the IC, allowing the IC to be connected to other components. This enables the IC to send and receive data between components. This ability to pass data along the PCB is vital for many applications. Without it, the signals would not be able to be transmitted between components, thus rendering the circuit useless.The main types of IC sockets used are: DIP (Dual In-line Package), PLCC (Plastic Leaded Chip Carrier), QFN (Quad Flat Pack), and SOIC (Small Outline Integrated Circuit). Each type has its own electrical and mechanical characteristics, which make them suitable for different types of circuit board designs and applications.The most common type of socket is the dual-in-line package socket (DIP). This is the typical socket for simple ICs with low power and small pin count. The pin contacts are usually made from steel and the body is made of plastic. DIP sockets are best suited for applications requiring a higher number of pins that will not move much.PLCC sockets are commonly used for ICs with medium to high power, and higher pin counts. The main difference from DIP sockets is that the pin contacts are made from metal and the body is plastic or ceramic. The metal-to-metal contacts allow for better electrical contact between the IC and the socket, which makes them suitable for higher power applications and helps protect the IC from damage due to thermal shock.QFN (Quad Flat Pack) sockets are primarily used for ICs with extremely small pin counts, such as those used in high-end communications systems. Unlike DIP and PLCC sockets, which have protruding metal pins, QFN sockets do not have pins. Instead, the contacts are “quadrants” that are located around the perimeter of the IC package. Because the openings are free of metal protrusions, QFN sockets provide better protection against ESD damage.SOIC (Small Outline Integrated Circuit) sockets are very common and very similar to DIP sockets. They are significantly smaller in size, and offer a much higher pin count. The contacts are usually made from steel and the body is usually made from plastic. SOIC sockets are used for ICs with low power and higher pin counts.Sockets enable secure and reliable connectivity for an IC or transistor. By offering varying pin counts and electrical characteristics, these types of sockets have enabled the development of circuit boards that can accommodate larger and more powerful ICs. These sockets are an essential component for a wide range of applications, from simple multiplexers to complex communications systems.

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