| Allicdata Part #: | 324-41-102-41-002000-ND |
| Manufacturer Part#: |
324-41-102-41-002000 |
| Price: | $ 8.75 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Mill-Max Manufacturing Corp. |
| Short Description: | CONN SKT SNG |
| More Detail: | 2 Position Receptacle Connector Through Hole |
| DataSheet: | 324-41-102-41-002000 Datasheet/PDF |
| Quantity: | 1000 |
| 50 +: | $ 7.87787 |
Specifications
| Insulation Color: | Black |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material: | Beryllium Copper |
| Contact Shape: | Circular |
| Insulation Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Applications: | -- |
| Voltage Rating: | -- |
| Current Rating: | 3A |
| Features: | -- |
| Ingress Protection: | -- |
| Mated Stacking Heights: | -- |
| Contact Finish - Post: | Tin |
| Material Flammability Rating: | -- |
| Operating Temperature: | -55°C ~ 125°C |
| Contact Length - Post: | 0.630" (16.00mm) |
| Insulation Height: | 0.110" (2.79mm) |
| Series: | 324 |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Finish - Mating: | Gold |
| Fastening Type: | Push-Pull |
| Termination: | Wire Wrap |
| Mounting Type: | Through Hole |
| Row Spacing - Mating: | -- |
| Number of Rows: | 1 |
| Pitch - Mating: | 0.100" (2.54mm) |
| Number of Positions Loaded: | All |
| Number of Positions: | 2 |
| Style: | Board to Board |
| Contact Type: | Female Socket |
| Connector Type: | Receptacle |
| Part Status: | Active |
| Packaging: | Bulk |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Sockets for ICs, Transistors comprises a variety of mechanisms and methods for connecting integrated circuits (ICs) or transistors to electronic equipment. This includes sockets, modules, or fittings that are used to mount ICs or transistors on a printed circuit board (PCB) or chassis. Socketing ICs and transistors has many advantages, including: increased protection from environmental contamination; improved connection continuity; cost savings arising from reduced downtime; and increased speed when repairing/replacing components. There is a wide range of socket designs that is tailored to the specific performance requirements of the application. This article will explore the different types of sockets for ICs and transistors, as well as their working principles.
Types of Sockets for ICs and Transistors
There are various types of sockets for ICs and transistors available in the market. These are classified into:- Zero insertion force (ZIF) sockets: ZIF sockets are the most common type of socket used for socketing ICs. They are designed to make it easier to plug in and remove ICs without the need for force. The contact pin of the socket is held in place by a mechanism, and when an IC is inserted, the mechanism is released, allowing the contact pins to move and mate with the IC contact pads.
- Pin grid array (PGA) sockets: PGA sockets are designed for mounting pin grid array (PGA) ICs. They are similar to ZIF sockets, but with additional metal base plates to accommodate the larger pin grid array structures. These are generally designed to use a higher level of force to mate the contact pins of the socket and IC.
- Surface mount technology (SMT) sockets: SMT sockets are designed to accommodate surface-mounted ICs. These are generally designed to use a lower level of force than PGA and ZIF sockets, allowing them to accommodate smaller contact pads.
- Through hole technology (THT) sockets: THT sockets are designed for mounting through-hole ICs and transistors. These sockets are usually mounted to the PCB with a through-hole and use standard contact pins that mate with the contact pads on the IC or transistor.
Working Principle of Sockets for ICs and Transistors
The working principle of sockets for ICs and transistors can be broken down into two main components: the contact pins and the mounting mechanism. The contact pins are the main components of the socket, and they are designed to mate with the contact pads on the ICs or transistors. The contact pins are made from a range of materials depending on the application and are typically plated with a conductive material to ensure proper contact between the pins and pads. The mounting mechanism is the part of the socket that holds the contact pins in place during insertion and removal. This is typically done with the use of a spring or lever, and depending on the type of socket, the force used to mate the pins with the contact pads can vary.Conclusion
Sockets for ICs and transistors are essential components in electronic equipment, as they allow ICs and transistors to be connected to the PCB or chassis without the need for soldering. This reduces downtime and makes it easier to replace faulty components. The different types of sockets are tailored to their specific applications, with ZIF sockets being used for ICs, PGA sockets for pin grid array ICs, SMT sockets for surface-mounted ICs, and THT sockets for through-hole ICs and transistors. The working principle of sockets for ICs and transistors can be broken down into two components: the contact pins and the mounting mechanism. The contact pins mate with the contact pads on the IC or transistor, and the mounting mechanism holds the contact pins in place. In conclusion, sockets for ICs and transistors play an important role in electronic equipment, and there is a vast range of socket designs available in the market for different applications.The specific data is subject to PDF, and the above content is for reference
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324-41-102-41-002000 Datasheet/PDF