34-7450-10

Termination:	Solder
Contact Resistance:	--
Current Rating:	1.5A
Material Flammability Rating:	UL94 V-0
Termination Post Length:	0.150" (3.81mm)
Operating Temperature:	-55°C ~ 105°C
Housing Material:	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post:	Phosphor Bronze
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Finish - Post:	Tin
Pitch - Post:	0.100" (2.54mm)
Series:	700 Elevator Strip-Line™
Features:	Elevated
Mounting Type:	Through Hole
Contact Material - Mating:	Phosphor Bronze
Contact Finish Thickness - Mating:	200.0µin (5.08µm)
Contact Finish - Mating:	Tin
Pitch - Mating:	0.100" (2.54mm)
Number of Positions or Pins (Grid):	34 (1 x 34)
Type:	SIP
Part Status:	Active
Packaging:	Bulk

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Sockets for ICs, Transistors

A 34-7450-10 Socket is an integrated circuit (IC) or transistor socket with an integrated heat sink, designed to provide superior cooling with minimal heat dissipation. The socket is designed to mount on a circuit board or surface mount package to provide a heat sink. The socket is designed to accommodate a variety of integrated circuits and transistors with a wide range of power ratings and package sizes.The socket is designed with a low mass and high thermal capacity, allowing it to dissipate a large amount of heat. The socket features a heat sink plate with high conductivity copper components, ensuring an even heat distribution area. The heat sink plate is designed to support a wide range of devices. The socket is designed to fit both through-hole and surface-mount devices and can be installed easily.The 34-7450-10 Socket is a pin and tube style socket that is designed to accept most ICs and transistors. The socket is designed with an internal heat sink plate that is made of high-grade copper. The heat sink plate is designed to transfer heat from the device to the environment, keeping it from building up and damaging the IC or transistor.The application field and working principle of the socket are relatively straightforward. Once installed on a circuit board or surface mount package, the socket provides a heat sink to dissipate the heat generated by the devices connected to it. The heat is dissipated by the heat sink plate, which transfers the heat away from the device and to the environment.The socket is also designed to ensure that the device is securely connected to the circuit board or surface mount package. The socket features a locking mechanism that is designed to securely tighten the devices onto the socket, ensuring that the device is securely in place. This ensures that the device will not vibrate or move even when subjected to high current and/or high temperature.The 34-7450-10 Socket is a reliable solution for applications where heat dissipation and secure connections are key. The socket is designed to provide superior cooling and secure connections in applications such as power supplies, automotive electronics, and communications systems. The base plate design reduces the thermal resistance and ensures that the heat is evenly distributed to the environment. The socket also allows the user to easily install and remove devices, making it a convenient and intuitive solution for any application.

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