349-10-109-00-560000 Allicdata Electronics
Allicdata Part #:

ED3264-09-ND

Manufacturer Part#:

349-10-109-00-560000

Price: $ 5.31
Product Category:

Connectors, Interconnects

Manufacturer: Mill-Max Manufacturing Corp.
Short Description: CONN HEADER 9POS SMD SNGL ROW
More Detail: Connector Header Surface Mount 9 position 0.100" (...
DataSheet: 349-10-109-00-560000 datasheet349-10-109-00-560000 Datasheet/PDF
Quantity: 1000
1 +: $ 4.78170
10 +: $ 4.44087
100 +: $ 3.87167
500 +: $ 3.53003
1000 +: $ 3.24535
5000 +: $ 2.96066
10000 +: $ 2.84680
Stock 1000Can Ship Immediately
$ 5.31
Specifications
Operating Temperature: --
Insulation Height: 0.110" (2.79mm)
Contact Shape: Circular
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Material: --
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
Features: --
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: --
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Applications: --
Number of Positions Loaded: All
Packaging: Bulk 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 9
Number of Rows: 1
Row Spacing - Mating: --
Series: 349
Style: Board to Board
Shrouding: Unshrouded
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.136" (3.45mm)
Contact Length - Post: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Rectangular Connectors - Headers, Male Pins provide an ideal method to interconnect a variety of components. They are typically used in applications that require high density board-to-board or plug-in connections. The most common application is 349-10-109-00-560000.

This type of connector is designed as a rectangular array of mating vertical pins and sockets and is available in multiple pin counts per row. Generally this type of connector has a ground path contact between the ends of the connector. A typical rectangular connector consists of a female body, a pair of mating male contacts and a mating/unmating hole or finger latch.

The 349-10-109-00-560000 is a two- and three-contact model that can be used to pair signal lines, grounds, and power in thin lines, along with a large variety of matching accessories such as dust covers, dielectric covers and grounding wires. It boasts a robust compression contact for use in harsh environments, such as in industrial networks, automotive applications and consumer electronics.

The 349-10-109-00-560000 provides a robust mechanical connection with a maximum current rating of 5A. Its design consists of silver-plated contacts with tin plating for corrosion resistance, and its housing features a superior clamping mechanism for secure grounding. The low insert height makes it suitable for a variety of board-to-board applications, as well as other applications that may require decreased insert heights.

In terms of its working principle, the 349-10-109-00-560000 makes use of an efficient metal-to-metal contact to make a secure, durable connection. The design also incorporates two internal terminals and a compression contact, which provides a secure grounding path for maximum system performance. The contacts are designed to compress as the pins are pushed in, creating a high contact force between the pins and terminals that ensures reliable performance in the toughest operating environments.

Overall, the 349-10-109-00-560000 provides a versatile solution for applications that require high density board-to-board or plug-in connections which require added durability and performance. The robust compression contact makes it suitable for a wide variety of environments, including industrial, automotive, and consumer electronic applications. In addition, its low insert height makes it an ideal choice for applications that require the highest connection density with the least footprint.

The specific data is subject to PDF, and the above content is for reference

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