4-1437531-9 Allicdata Electronics
Allicdata Part #:

4-1437531-9-ND

Manufacturer Part#:

4-1437531-9

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN IC DIP SOCKET 16POS TIN
More Detail: N/A
DataSheet: 4-1437531-9 datasheet4-1437531-9 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: --
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: --
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Wire Wrap
Series: 500
Mounting Type: Through Hole
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: --
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Obsolete
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors

4-1437531-9 is an application specific integrated circuit (ASIC) used in several fields, including power management, aerospace, and telecommunications. It is one of the most advanced socket products available today capable of transferring large amounts of data. The socket provides additional functions such as ESD protection, power management, and signal conditioning. Additionally, 4-1437531-9 extends pins which provide protection against thermal shock, vibration, and corrosion.

The primary purpose of 4-1437531-9 technology is to reduce cost and time associated with development and deployment of products. By replacing larger logical components with a single integrated component, significant savings on cost and complexity can be achieved. Additionally, systems become more robust since there are fewer components needed to be integrated to reach the same functionality. Finally, due to the heat dissipation afforded by the socket, systems become more power-efficient. This is especially true in the telecom and aerospace fields, which have a long history of specialized technologies.

The 4-1437531-9 socket is made of several components that allow its components to be easily and quickly replaced in applications. Specifically, the socket consists of a substrate, a socket base, and an external contacts. The substrate provides the mechanical stability to hold the IC in place. Additionally, the substrate consists of a thermally conductive material to disperse heat generated from the IC. The external contacts provide connections to the outside world and provide power and signal conditioning. The socket base provides a stable, grounded connection between the IC and external devices.

The working principle of 4-1437531-9 is relatively straightforward. When power is applied to the socket, the contacts between the socket and the IC establish a connection. This connection allows the application to be powered and/or to communicate with the IC. Depending on the application, the socket can also be used for managing and controlling other components as well as communication protocols. Since this type of socket technology is relatively new, it is best suited for applications that require high levels of thermal stability, power management, and signal integrity.

In summary, 4-1437531-9 is an ASIC technology that is specifically designed for various applications. It offers cost and complexity reduction as well as improved heat dissipation and power management. Additionally, its external contacts provide power and signal conditioning. Finally, its working principle is straightforward, providing a fast and reliable connection between the IC and external devices.

The specific data is subject to PDF, and the above content is for reference

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