40-6508-302 Allicdata Electronics
Allicdata Part #:

40-6508-302-ND

Manufacturer Part#:

40-6508-302

Price: $ 9.21
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 40POS GOLD
More Detail: N/A
DataSheet: 40-6508-302 datasheet40-6508-302 Datasheet/PDF
Quantity: 1000
7 +: $ 8.36458
Stock 1000Can Ship Immediately
$ 9.21
Specifications
Termination: Wire Wrap
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.360" (9.14mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 508
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, transistors, and other small electronic components have become an increasingly ubiquitous part of modern electronics. Connectivity between different components is a critical part of any design, and these sockets provide a convenient over-molding to facilitate connections without risking damage to the component itself. The 40-6508-302 socket is one such part, designed for use with small semiconductors and providing an extremely low-profile solution for board-to-board connections.

Applications

The 40-6508-302 socket is a versatile and robust option for applications requiring extremely small size. It can be used for prototyping purposes—especially in cases where prototype boards require ease of access and diagnostics. It also works well for more permanent implementations in small, space-constrained products.

The 40-6508-302 socket is especially suitable for semiconductor ICs ranging from 8 to 28 pins. It is also optimized for use with surface-mount sockets, so that small components can be easily connected without the need for expensive soldering equipment. These sockets feature a shield to protect I/O pins from any static electricity, dust, or other contaminants.

Features and Benefits

The 40-6508-302 socket offers a number of advantages for applications with limited size characteristics. First, it is extremely small and versatile, making it ideal for embedded designs and allowing for a wide range of component types to be connected. Second, it supports a wide range of pin packing configurations due to its flexible design. Third, it requires minimal soldering, making it easy to install and maintain.

The 40-6508-302 socket also features an integrated shielding layer for optimal signal integrity in the connection. It also has a convenient locking mechanism to ensure that the connection is secure and that no accidental disconnects will occur. Additionally, each connection point is hermetically sealed for extra durability and ultimate reliability.

Working Principle

The 40-6508-302 socket works by providing a simple solution for board-to-board connections within a small form factor. It features an over-molded cover and insulation sheet that ensures secure yet flexible connections. The socket mates with its surface-mount counterparts and has a minimal footprint. The insulation sheet provides protection against dust, static electricity, and other contaminants.

The 40-6508-302 socket also features a spring-loaded locking mechanism that ensures a secure connection. The locking mechanism is adjustable in order to fit a variety of component sizes and types. The sockets provide a minimal contact with the PCB, reducing stray currents and further improving signal integrity.

In summary, the 40-6508-302 socket is an ideal solution for applications requiring a small form factor and robust connectivity. Its versatile design allows for a wide range of ICs and transistors to be connected, while its integrated shielding and hermetically sealed connections maximize signal integrity and durability. It is easy to install and maintain, making it a great choice for prototyping and embedded applications.

The specific data is subject to PDF, and the above content is for reference

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