| Allicdata Part #: | 40-6518-01-ND |
| Manufacturer Part#: |
40-6518-01 |
| Price: | $ 9.40 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Aries Electronics |
| Short Description: | CONN IC DIP SOCKET 40POS GOLD |
| More Detail: | N/A |
| DataSheet: |  40-6518-01 Datasheet/PDF |
| Quantity: | 1000 |
| 8 +: | $ 8.54280 |
| Termination: | Solder |
| Contact Resistance: | -- |
| Current Rating: | 3A |
| Material Flammability Rating: | UL94 V-0 |
| Termination Post Length: | 0.125" (3.18mm) |
| Operating Temperature: | -- |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Material - Post: | Brass |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Finish - Post: | Gold |
| Pitch - Post: | 0.100" (2.54mm) |
| Series: | 518 |
| Features: | Open Frame |
| Mounting Type: | Through Hole |
| Contact Material - Mating: | Beryllium Copper |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Finish - Mating: | Gold |
| Pitch - Mating: | 0.100" (2.54mm) |
| Number of Positions or Pins (Grid): | 40 (2 x 20) |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Part Status: | Active |
| Packaging: | Bulk |
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Sockets for ICs, Transistors and 40-6518-01 application field and working principle are popular topics in the electronics industry. This article will take a look at what 40-6518-01 is, its application field and its working principle.
40-6518-01 is an integrated circuit (IC) socket designed for a 0.8mm pitch QFP52 package. It has a low profile body design that is suitable for applications in high-density packaging and is often used for testing, prototyping, and repairing. It is made of robust high temperature thermoplastic materials for durability and matching performance. The pads are laid out in a straight pattern for easy and reliable installation.
The 40-6518-01 is designed for a specific application field, which is Thermal Interface Technology (TFT). TFT is a technology used to build electronic displays, such as LCD and OLED screens. It uses a heat-conductive material such as a thermal pad, grease, or film to transfer heat from the IC to the casing or heat sink, which helps to dissipate the heat generated by the IC. The 40-6518-01 socket is designed to provide a reliable connection between the IC package and the TFT material and helps to sustain the high temperatures provided by the thermal interface.
The 40-6518-01 also has a working principle of pin-in-paste technology. This means that instead of soldering the IC package directly on the PCB, a powder-filled paste is applied on the pads of the PCB. During installation, the IC package is placed on the paste and a force is applied to make sure that all the pins go through the paste and make a reliable electrical connection with the board. This helps to reduce manufacturing costs and improves the reliability of the connection.
The 40-6518-01 is a reliable and cost-effective solution for TFT applications. Its low profile body design makes it suitable for high density packaging and its pin-in-paste technology helps to reduce manufacturing costs. It is an excellent choice for testing, prototyping, and repairing electronic devices.
The specific data is subject to PDF, and the above content is for reference
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