40-6574-16 Allicdata Electronics
Allicdata Part #:

40-6574-16-ND

Manufacturer Part#:

40-6574-16

Price: $ 25.07
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET ZIF 40POS TIN
More Detail: N/A
DataSheet: 40-6574-16 datasheet40-6574-16 Datasheet/PDF
Quantity: 1000
8 +: $ 22.56660
Stock 1000Can Ship Immediately
$ 25.07
Specifications
Series: 57
Packaging: Bulk 
Part Status: Active
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: --
Termination Post Length: 0.110" (2.78mm)
Material Flammability Rating: UL94 V-0
Current Rating: 1A
Contact Resistance: --
Description

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Sockets for Integrated Circuits (ICs) and Transistors have become a necessity for many modern electronics and electrical systems. The 40-6574-16 socket is a widely used model due to its flexibility and ease of use. With its innovative design, it offers perfect protection, maximum durability, and an ideal housing for a wide range of semiconductor applications.

The 40-6574-16 socket is a two-piece BGA socket, meaning it has two separate contacts, meaning it can be used for a variety of applications. It is suitable for over 35 different BGA packages, including TQFN, DFN, QFN, and Flip Chip. The contacts are gold plated for added reliability and durability. The contact pins have a maximum current of 10 Amps and can easily be soldered and re-soldered for convenience. It is also designed to accommodate up to 0.5" pitch spacing.

The 40-6574-16 socket has a variety of applications and is often used in a wide range of industrial, commercial, and consumer electronics. It is particularly well suited for hi-tech applications, such as computers and communication systems, due to its small size and ability to handle high currents. Additionally, the 40-6574-16 socket is ideal for applications requiring high-density packaging, such as smartphones and tablets.

The 40-6574-16 socket utilizes a low resistance contact method to ensure perfect contact and maximum reliability. It is constructed from high-grade materials to ensure maximum durability. The socket is also designed to provide a secure housing, which prevents any contact damage and ensures reliable operation. It\'s secure housing also prevents any corrosion or oxidation of the contact pins.

The 40-6574-16 socket has a wide range of advantages that make it the ideal choice for many applications. It is reliable, durable, secure, and easy to use. Additionally, its low resistance contact method ensures perfect contact and maximum reliability for different types of semiconductors. Furthermore, its secure housing prevents contact damage and corrosion, so it can be used in harsh environments without any worries. Finally, its small size is ideal for hi-tech applications in computers and communication systems.

Overall, the 40-6574-16 socket is an ideal choice for a wide range of semiconductor applications. It is designed to provide perfect contact, maximum reliability, and secure housing, which is why it is popular in many industrial, commercial, and consumer electronics. With its low resistance contact method and durable construction, it is able to handle high currents and provide reliable performance in harsh environments. Thanks to these features, the 40-6574-16 socket is the perfect solution for a range of applications that require high-density packaging.

The specific data is subject to PDF, and the above content is for reference

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