40-6822-90C Allicdata Electronics
Allicdata Part #:

40-6822-90C-ND

Manufacturer Part#:

40-6822-90C

Price: $ 9.29
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 40POS GOLD
More Detail: N/A
DataSheet: 40-6822-90C datasheet40-6822-90C Datasheet/PDF
Quantity: 1000
7 +: $ 8.43927
Stock 1000Can Ship Immediately
$ 9.29
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.140" (3.56mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: Vertisockets™ 800
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to 40-6822-90C sockets for ICs, Transistors

40-6822-90C is a type of socket that is specifically designed for the development and testing of ICs, transistors, and other devices. It is a high-performance socket solution that ensures quick connection, stable power delivery, reliable performance, and longer lifetime. These sockets provide the user with a comprehensive range of design flexibility, in terms of size, mounting style, and connection types. The 40-6822-90C socket comes with customizable features to ensure maximum compatibility. It is capable of working with devices in the size range of SOP and TSSOP. It provides reliable connections, higher signal integrity, and high throughput performance. It is also capable of providing power delivery through AC and DC connections.

40-6822-90C Application Field and Working Principle

40-6822-90C sockets are widely used in the development and testing of ICs, transistors, and other types of complex devices. By plugging a device into the socket, it allows for the electrical connection of the device, while the mechanical locking features hold the device in place. The socket has pins that are aligned perfectly on the IC package, and thus, all the test signals and power connections are accurately connected.

The working principle of the socket is based on the principle of electromechanical contact. The socket pins make contact with the contact pads on the IC package, and a spring mechanism provides secure latching of the device. This ensures that the device is firmly secured within the socket without any mechanical slipping. The spring mechanism also applies a consistent amount of force to the IC package to ensure reliable contact and connection.

The socket features several components that ensure reliable performance. These include a switch which is a metal plate that activates when the circuit is completed. It comes with a socket holder which helps to secure the IC package and is used to mechanically attach the socket to the circuit board. A shuttle is also present to move the device axially and ensure secure connection. It also contains an LED which indicates when the circuit is complete.

The 40-6822-90C socket is highly beneficial for device development and testing. It ensures signal integrity, stable power delivery, and secure latching. It is also capable of withstanding high voltage, currents, and temperatures, making it an ideal solution for testing and design purposes.

Conclusion

The 40-6822-90C socket is a high-performance socket solution that is specifically designed for the development and testing of ICs, transistors, and other complex devices. It features a comprehensive range of customizable features to ensure compatibility with the device package. The socket is capable of providing reliable connections, higher signal integrity, and high throughput performance. It is also able to withstand high voltage, currents, and temperatures, making it an ideal choice for testing and design purposes. With its robust design, it ensures reliable and safe connections for the device during development and testing.

The specific data is subject to PDF, and the above content is for reference

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