40-C300-30 Allicdata Electronics
Allicdata Part #:

40-C300-30-ND

Manufacturer Part#:

40-C300-30

Price: $ 12.66
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 40POS GOLD
More Detail: N/A
DataSheet: 40-C300-30 datasheet40-C300-30 Datasheet/PDF
Quantity: 1000
5 +: $ 11.51010
Stock 1000Can Ship Immediately
$ 12.66
Specifications
Termination: Wire Wrap
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.040" (1.02mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: EJECT-A-DIP™
Features: Closed Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors, play an important role in many electronic circuits. They are used to connect devices such as Micro-Controllers, Processors and Discrete Components. The technology involved in creating these sockets has advanced greatly over the years, leading to additional options like the 40-C300-30.

The 40-C300-30 socket has a unique application field and working principle. It’s specifically designed for use with integrated circuits (ICs), transistors, and other semiconductor components. Essentially, it’s a device that provides an electrical connection between two or more components. This allows for faster and more reliable data transmission, and provides the user with increased system performance.

The 40-C300-30 socket is based on a zero insertion force (ZIF) technology. This technology eliminates the need for the user to manually apply any pressure to the component when installing it in the socket. This device is constructed from a high-performing polyester material and incorporates a precision mechanical design.

The 40-C300-30 socket has been designed to work with a wide range of ICs and transistors, including the latest semiconductor devices. It offers improved signal integrity, which in turn leads to better overall system performance. When combined with the right heat dissipation system, the thermal characteristics of the device can be adjusted as needed.

The 40-C300-30 socket can be used to mount a variety of semiconductor devices, including BGA, CSP, and EMC sockets. It’s ideal for applications where multiple ICs or transistors need to be connected to a single pin. The socket is designed to remain firmly in place when removing a component, which means there’s no risk of damaging the circuit. Additionally, the device is compact and lightweight, making it easy to install and remove.

The 40-C300-30 socket offers a variety of benefits. It’s designed to handle repeated insertion and removal of components, which means less downtime during maintenance. In addition, the device is constructed from a durable material that offers superior temperature and shock resistance. And because it’s easy to install and remove, it’s perfect for applications that require frequent reconfiguration.

The 40-C300-30 socket offers a reliable connection between ICs, transistors, and other semiconductor components. It eliminates the need for manual pressure application and provides superior signal integrity. It’s constructed from a durable material and is designed to handle repeated insertion and removal of components. And because it’s compact and lightweight, it’s ideal for applications that require frequent reconfiguration or maintenance.

The specific data is subject to PDF, and the above content is for reference

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