400-040-000 Allicdata Electronics
Allicdata Part #:

400-040-000-ND

Manufacturer Part#:

400-040-000

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: 3M
Short Description: CONN IC DIP SOCKET 40POS GOLD
More Detail: N/A
DataSheet: 400-040-000 datasheet400-040-000 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 8.00µin (0.203µm)
Contact Material - Post: --
Housing Material: --
Operating Temperature: --
Termination Post Length: --
Material Flammability Rating: --
Contact Resistance: --
Series: 400
Packaging: --
Part Status: Obsolete
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Material - Mating: --
Mounting Type: Through Hole
Features: Open Frame
Termination: --
Description

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Sockets for ICs, Transistors

Integrated Circuits (ICs) are a type of semiconductor device that is made up of a number of transistors, or small electrical switches, on a single chip. Transistors are devices which can be used to amplify, or increase, electrical signals. They are also used as switches, for example, to control the flow of current. When several transistors and other devices are integrated on a single chip, it becomes a single IC.

Sockets for ICs and transistors are special types of connectors that are designed to be used for connecting one or more ICs and transistors together. The socket is usually placed in a printed circuit board (PCB) which can contain a variety of components, such as resistors, capacitors, and other types of circuit components.

The most common type of socket for ICs and transistors is the 400-040-000 (BGA) socket. BGA stands for ball-grid array, which is a type of socket that is designed to hold multiple ICs and transistors. The BGA socket is designed in such a way that it securely holds several ICs and transistors in place and it also allows for easy electrical signals to be transmitted between the ICs and transistors.

The BGA socket is typically used in applications where multiple ICs and transistors are needed in a small design. It allows for the ICs and transistors to be arranged in a highly compact layout, which makes it ideal for use in printed circuit boards that have limited space. BGA sockets are also used for parts that are susceptible to electrostatic discharge (ESD), such as in sensitive components, since they have a low ESD potential.

BGA sockets have several advantages over other types of sockets. First, they have a high density design which makes them suitable for use in small areas. Secondly, they are easy to install and require minimum effort to fit. Thirdly, they are durable and are capable of withstanding repeated insertions and removals.

The working principle of BGA sockets is fairly simple. When the IC or transistor is placed in the socket, the contact points, which are also known as lands, on the bottom of the IC or transistor are lined up with pins on the bottom of the BGA socket. This ensures electrical connectivity between the IC or transistor and the pins of the socket. The pins are then soldered to the printed circuit board (PCB) in order to provide a secure connection.

BGA sockets are most commonly used in applications such as computers, mobile phones, and other communication devices. They are also frequently used in applications where large numbers of ICs and transistors are needed. With their high density design, they are ideal for use in space-restricted applications, such as in laptops, tablets, and other consumer electronics.

The specific data is subject to PDF, and the above content is for reference

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