42-3570-11

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 42-3570-11 device is a socket used for integrated circuit packages. It has an outer shell made of black thermoplastic material with no metal parts and is designed to plug into a IC socket. It is primarily used in electronic assembles and for mounting transistors and ICs for testing, prototyping, and repairs.

The socket’s primary application is to attach transistors or integrated circuits to circuit boards for prototyping and repairs. It has several advantages over a breadboard adapter, including better flexibility, more power handling capabilities, and lower cost. Other applications include industrial control systems and embedded systems where ICs are used to increase performance.

The 42-3570-11 socket is a dual-row socket with the IC connections located on the top and the power connections located on the bottom. It has a total of thirty-six pins, including four power pins, four ground pins, and twenty-eight signal pins. The bottom row of the socket is pre-wired to the power supply connections while the top row provides a place for connecting the IC pins.

The 42-3570-11 works on the principle of thermal contact. This is a principle whereby a thermal conduction element, such as a thermoplastic shell, aids in the efficient transfer of heat from the IC to the lead frames of the socket. The shell helps dissipate the heat before it can reach the lead frames which ensures that the ICs and components mounted in the socket are not damaged by heat.

The thermal contact principle works by creating a bridge between the IC’s thermal conductivity and the socket’s thermal resistance. As heat is generated in the IC, it is conducted through the thermal bridge and spread across the socket’s surface area, thus dissipating the heat. This prevents the heat from being concentrated in a single area on the lead frame and prevents damage to the ICs or other components that are mounted in the socket.

The benefit of using the thermal contact principle is that it ensures better heat dissipation from the IC. This helps to extend the life of the IC as it prevents damage from excessive heat build-up. It also helps to reduce the risk of damage to other nearby components as the heat is dissipated quickly and evenly.

In conclusion, the 42-3570-11 socket is an essential part of any IC assembly. It provides a reliable way to mount and test ICs and transistors, as well as a means of dissipating heat in order to protect them from damage. The thermal contact principle used by this socket helps to ensure that the ICs and other components mounted in it are kept safe from heat buildup.

The specific data is subject to PDF, and the above content is for reference