Allicdata Part #: | 42-3572-10-ND |
Manufacturer Part#: |
42-3572-10 |
Price: | $ 11.12 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aries Electronics |
Short Description: | CONN IC DIP SOCKET ZIF 42POS TIN |
More Detail: | N/A |
DataSheet: | 42-3572-10 Datasheet/PDF |
Quantity: | 1000 |
6 +: | $ 10.11040 |
Termination: | Solder |
Contact Resistance: | -- |
Current Rating: | 1A |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.110" (2.78mm) |
Operating Temperature: | -- |
Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Contact Material - Post: | Beryllium Copper |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Finish - Post: | Tin |
Pitch - Post: | 0.100" (2.54mm) |
Series: | 57 |
Features: | Closed Frame |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
Contact Finish - Mating: | Tin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 42 (2 x 21) |
Type: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
Part Status: | Active |
Packaging: | Bulk |
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The 42-3572-10 socket is one of the most widely used sockets for ICs, transistors, and other integrated chip devices. It is a three-pole or socket that is designed to accept various types of IC devices with a maximum current rating of 10 amperes. The socket features a three-pole function, ground terminal, and mounting hole for screws.
The 42-3572-10 is designed to provide an efficient and reliable way of connecting ICs, transistors, and other integrated chip devices to a circuit board. It is often used to replace larger, bulky IC sockets used for more powerful components or to reduce overall power consumption when operating on smaller battery-powered circuits. The socket’s three-pole design makes it suitable for use in multiple configurations, allowing for flexibility when planning layout designs. The terminals are spaced in such a way that they accept standard chip packages as well as various DIP and BGA chips.
The 42-3572-10 has several key features that make it ideal for use in a wide range of applications. Its three-pole design ensures that the current flow is balanced across the poles, reducing the risk of overheating and electrical damage to the circuit. The ground terminal prevents noise interference between the circuit and the IC, while the mounting hole provides secure attachment to the circuit board. Additionally, the socket is designed to be lightweight and installed quickly.
The working principle of the 42-3572-10 socket is based on the concept of conductor-to-isolator conversion. The socket contains pins that are electrically connected to the device being processed and are usually made of copper or stainless steel. These pins are then surrounded by a highly conductive dielectric material. This dielectric material is effective in limiting the current flow between the pins, thereby providing isolation for the device. The dielectric material is typically made of ceramic, polymers, or silicon carbide.
The 42-3572-10 socket is primarily used in the automotive, computer, electronics, and telecommunications industries. Its use in the automotive industry is common in engine computers, as the socket provides an efficient and reliable way to connect various ICs and transistors. Due to its robust design, the 42-3572-10 socket is also used in various applications, such as in wireless headphones, flight control systems, satellite communications, and PC motherboards.
The 42-3572-10 socket is a reliable, efficient, and durable option for connecting ICs and transistors in a variety of applications. Its three-pole design ensures a balanced current flow, while its dielectric material provides isolation for the device. Additionally, the socket is designed to be lightweight and installed quickly, making it suitable for any circuit board or device setup. From automotive to telecommunications, the 42-3572-10 has earned its place as one of the most widely utilized sockets for ICs, transistors, and other integrated chip devices worldwide.
The specific data is subject to PDF, and the above content is for reference
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