430104-501

Thermal - Thermoelectric, Peltier Modules have many applications in a variety of scientific, technological, medical and other fields. The 430104-501 model is often used due to its high efficiency and reliability. It also provides a wide range of temperatures, a heated surface and a cooling surface, as well as a simple connection system. The size of the module is 4.4\'\' x 3.9\'\' x 0.5\'\'.

Thermoelectric cooling (TEC) is based on the Peltier effect. The Peltier effect is a physical phenomenon wherein a voltage difference between two materials connected in an electric circuit can generate heat and when two different materials are connected to a circuit in a different direction, a temperature difference can also be created. In other words, when current flows, heat is transferred between the two materials, one hot and one cold, in opposite directions.

The 430104-501 model is designed with four “fingers” and six “ribs” to create a high-efficiency thermal conducting area. The four “fingers” help to conduct the heat from the connected device to the module while the six “ribs” help to disperse the heat from the module. The combination of the four “fingers” and six “ribs” creates a high-efficiency thermal connection, allowing for increased heat transfer efficiency.

In order to achieve the desired thermal performance, the 430104-501 should be connected to an already cooled device, such as a computer, or a device that has active cooling. This device should also be capable of transferring significant amounts of heat to the module. This can be done by placing the device in close proximity to the module without obstructing air flow. Heat from the device will then be transferred to the module.

The 430104-501 is equipped with two metal contacts on the top and bottom of the module. One contact should be connected to positive power and the other connection should be connected to negative power. When power is applied to the module, the Peltier effect is used to transfer heat from the device to the top of the module, thus cooling the device. The heat is then transferred from the top of the module to the bottom of the module, where it is dissipated away.

In conclusion, the 430104-501 is a versatile thermal solution that is suited for a wide variety of applications. The efficient thermal contact, dual contact design, and ability to conduct heat from a connected device make it an ideal solution for cooling. With these features, the 430104-501 is an excellent choice for any application that requires thermal management.