44-3573-10 Allicdata Electronics
Allicdata Part #:

44-3573-10-ND

Manufacturer Part#:

44-3573-10

Price: $ 11.62
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET ZIF 44POS TIN
More Detail: N/A
DataSheet: 44-3573-10 datasheet44-3573-10 Datasheet/PDF
Quantity: 1000
6 +: $ 10.55980
Stock 1000Can Ship Immediately
$ 11.62
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.110" (2.78mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 57
Features: Closed Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 44 (2 x 22)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

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Sockets for ICs,Transistors

The 44-3573-10 is a high-performance socket for integrated circuits (ICs) and transistors. It features robust design, miniature form factor, and a low-cost solution for a wide array of applications.

Application Field

The 44-3573-10 is ideal for components such as ICs and transistors, and is suitable for a variety of applications including automotive, aerospace, military, medical, electronic test and measurement and embedded industrial control systems. It is also suitable for applications such as long life circuits and circuits requiring high power or high-voltage operation. In addition, it can be used as a debugging tool for circuit boards.

Working Principle

The 44-3573-10 socket features a robust design with a miniature form factor. Its construction consists of a multi-layer insulated substrate with contact points made of an electroplated copper layer. An additional layer of insulated substrate is used to protect the internal connections from environmental and mechanical damage. The contact points are spaced at standard IC pin pitch distances to provide adequate contact to ensure reliable signal transmission.

The 44-3573-10 socket features a low-cost solution for a wide array of applications. Its low-resistance contact points, high temperature rating, and low profile form factor make it a superior product with a long life. It is also built for a wide temperature range, allowing it to be used in a variety of applications in different climates. Moreover, it is also designed with a high-reliability closure mechanism for a secure connection.

In conclusion, the 44-3573-10 socket is a high-performance product for ICs and transistors. Its robust design, miniature form factor, and low-cost solution make it an ideal choice for a variety of applications. It has a low-resistance contact points, a high temperature rating, and a low profile form factor, making it a superior product with a long life.

The specific data is subject to PDF, and the above content is for reference

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