Allicdata Part #: | 44-6556-41-ND |
Manufacturer Part#: |
44-6556-41 |
Price: | $ 30.25 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aries Electronics |
Short Description: | CONN IC DIP SOCKET 44POS GOLD |
More Detail: | N/A |
DataSheet: | 44-6556-41 Datasheet/PDF |
Quantity: | 1000 |
2 +: | $ 27.21910 |
Specifications
Termination: | Solder Cup |
Contact Resistance: | -- |
Current Rating: | 3A |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.180" (4.57mm) |
Operating Temperature: | -- |
Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Contact Material - Post: | Brass |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Finish - Post: | Gold |
Pitch - Post: | 0.100" (2.54mm) |
Series: | 6556 |
Features: | Open Frame |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 44 (2 x 22) |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Part Status: | Active |
Packaging: | Bulk |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Sockets for ICs, Transistors
The 44-6556-41 application field and working principle are beneficial to both the consumer and the developer of integrated circuits. This socket is a type of specialized electrical device used to receive integrated circuits for the purpose of ensuring proper operation in applications where reliable, high-density connections are required. By securely enclosing the chip, this type of socket can increase the performance and reliability of a circuit design while simultaneously providing easy and efficient chip insertion and extraction.The key features and benefits of the 44-6556-41 include its durability and its ability to accept up to four integrated circuit packages. This socket is designed with gold-plated contacts to create reliable electrical connections and provide excellent protection for the solder joint against corrosion and oxidation. The socket is also designed with a clear plastic hood that allows easy identification of the appropriate IC package, along with two support legs that work together to ensure secure placement. Finally, the socket is available in two different versions - a standard and a low-profile - each designed to accommodate different applications.The 44-6556-41 socket works based on the principles of electrical energy transfer, specifically the principle of electrical conduction. When a specific IC chip is inserted into the socket, the electrical connections are automatically made, allowing the electrical current to pass through the pins of the chip and the socket. This allows electrical signals to be passed between the chip and other components of the circuit, thus enabling the proper operation of the circuit design. The contact pins of the socket also typically have an anti oxidant applied to them, in order to reduce the accumulation of oxidation and the subsequent deterioration of the connection between the chip and the socket.By providing a robust and secure connection between the chip and socket, the 44-6556-41 socket can significantly improve the performance of integrated circuit designs. The socket eliminates potential shorts due to accidental contact with other components, while simultaneously providing increased protection for the chip and PCB. This allows circuit designers to develop circuit designs with more advanced features and better performance while also improving the design\'s reliability. Furthermore, the increased protection for the chip and PCB can help to reduce contact resistance and signal delay, ultimately resulting in improved signal integrity.Overall, the 44-6556-41 application field and working principle are beneficial to both the consumer and the developer of integrated circuits. Its durability and features enable more efficient and reliable circuit designs, while simultaneously providing increased protection for chips and PCBs. This results in improved signal integrity and reduces contact resistance, ultimately improving the overall performance of the circuit design.The specific data is subject to PDF, and the above content is for reference
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