44-6570-16 Allicdata Electronics
Allicdata Part #:

44-6570-16-ND

Manufacturer Part#:

44-6570-16

Price: $ 26.78
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET ZIF 44POS
More Detail: N/A
DataSheet: 44-6570-16 datasheet44-6570-16 Datasheet/PDF
Quantity: 1000
2 +: $ 24.09750
Stock 1000Can Ship Immediately
$ 26.78
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.110" (2.78mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Beryllium Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Finish - Post: Nickel Boron
Pitch - Post: 0.100" (2.54mm)
Series: 57
Features: Closed Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Nickel
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish - Mating: Nickel Boron
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 44 (2 x 22)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

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The 44-6570-16 Sockets for ICs, Transistors are an essential component in everyday electronics. They are used to connect one chip to another, and provide a reliable way of transferring signals between two devices with minimal interference. The 44-6570-16 are designed with the robust and reliable features needed for reoccurring connections in a variety of electronic devices.

The 44-6570-16 socket is designed to fit integrated circuits in multiple packages, including the SOIC, PLCC, and through-hole dual-in-line varieties. The 44-6570-16 socket has an internal connection structure of 16 pins separated into two rows of eight pins. The socket is designed to hold the chip in place securely when inserted and provide an accurate and reliable connection. Each pin is also marked so that the correct orientation can be determined upon insertion.

The 44-6570-16 sockets come in a variety of materials and forms. They can be a surface mount variety, suitable for being mounted directly onto a printed circuit board, or they can be a through-hole variety, which require insertion of the chip into the socket before fastening onto the board. The 44-6570-16 sockets are also made of a range of materials, from low-grade plastic to higher grade solder-retained metal.

In terms of their manufacturing process, the 44-6570-16 sockets are made by sandwiching a dielectric material between two conductive plates with small holes at one end. The dielectric (also referred to as the insulation layer) is then laser cut and placed under the lower plate. The pins are then fed into the holes of the lower plate and the assembly is soldered together. This results in a reliable connection between the chip and the pins inside of the socket.

The 44-6570-16 Sockets are generally used in applications where a reliable connection between the chip and the circuit board is crucial. The pins inside the socket not only provide a reliable connection, but they also help protect the chip from the external environment by providing physical protection against dust and debris. Additionally, 44-6570-16 sockets reduce the risk of destruction due to mechanical shock or vibration, as the pins are resilient.

When it comes to the working principle of the 44-6570-16 sockets, they make use of the electrical principal of capacitance. This occurs when two electrical elements are close together, and electrons will then accumulate and separate them. This is when the electrical current will flow. The pins of the 44-6570-16-sockets, once inserted into the chip, act as two such electrical elements and then enable the flow of electrons (or current) between the chip and the circuit board.

In conclusion, the 44-6570-16 Sockets for ICs, Transistors are an essential device in a multitude of electronic applications and serve to connect multiple chips together in a reliable and safe manner. Through the use of their pins and capacitance, these sockets enable the reliable and consistent transmission of electrical signals from chips to the circuit board.

The specific data is subject to PDF, and the above content is for reference

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