Allicdata Part #: | 441-PPG21001-10-ND |
Manufacturer Part#: |
441-PPG21001-10 |
Price: | $ 15.27 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aries Electronics |
Short Description: | CONN SOCKET PGA ZIF GOLD |
More Detail: | N/A |
DataSheet: | 441-PPG21001-10 Datasheet/PDF |
Quantity: | 1000 |
4 +: | $ 13.74030 |
Termination: | Solder |
Contact Resistance: | -- |
Current Rating: | 1A |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.125" (3.18mm) |
Operating Temperature: | -65°C ~ 125°C |
Housing Material: | Polyphenylene Sulfide (PPS) |
Contact Material - Post: | Beryllium Copper |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Finish - Post: | Tin |
Pitch - Post: | 0.100" (2.54mm) |
Series: | -- |
Features: | Closed Frame |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | -- |
Type: | PGA, ZIF (ZIP) |
Part Status: | Active |
Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The 441-PPG21001-10 is a socket for ICs, transistors. It is a high-performance 3.3V, 2.5V application-specific integrated circuit (ASIC) socket. It features a 0.5mm pitch, high-profile zero insertion force (ZIF) socket designed to accommodate a wide range of ICs, including transistors, ICs and custom socket combinations.
The 441-PPG21001-10 has a wide range of applications. It is used for low-power embedded processing applications, such as communications and automotive products; and high-performance computing applications, such as desktop, server, and cloud computing products. It is designed for wide operating temperature range (without external heating), from -40°C to 125°C.
The working principle of the 441-PPG21001-10 is based on the use of an array of contacts that are designed to make contact with the corresponding contact points on the IC or transistor package. The contacts are arranged in a specific pattern and are designed to ensure an optimum fit when mated with the package. The socket is also designed to ensure that the IC or transistors are properly seated in the socket with a minimum of force.
When an IC or transistor is inserted into the 441-PPG21001-10 socket, the contacts make contact with the corresponding contact pads on the package. The contacts are designed to provide a reliable connection between the package and the socket for reliable communication. The socket also provides a uniform fit, as well as a secure connection, that minimizes the possibility of package and socket failure.
The 441-PPG21001-10 is an ideal solution for high-performance applications that require reliable connections. It is also designed for wide temperature range operations and is a suitable option for embedded and computer system applications. With its robust design and high-performance features, the 441-PPG21001-10 socket can provide an excellent option for any IC or transistor application.
The specific data is subject to PDF, and the above content is for reference
CONN SOCKET PGA GOLD
CONN IC DIP SOCKET ZIF 28POS TIN
CONNECTOR
CONN SOCKET LGA 1356LGA GOLD
CONN CAMERA SOCKET 32POS GOLD
CONN SOCKET TRANSIST TO-5 4POS