48-3575-16 Allicdata Electronics
Allicdata Part #:

48-3575-16-ND

Manufacturer Part#:

48-3575-16

Price: $ 27.64
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET ZIF 48POS TIN
More Detail: N/A
DataSheet: 48-3575-16 datasheet48-3575-16 Datasheet/PDF
Quantity: 1000
6 +: $ 24.87240
Stock 1000Can Ship Immediately
$ 27.64
Specifications
Series: 57
Packaging: Bulk 
Part Status: Active
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: --
Termination Post Length: 0.110" (2.78mm)
Material Flammability Rating: UL94 V-0
Current Rating: 1A
Contact Resistance: --
Description

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Sockets for ICs, Transistors

Sockets for integrated circuits (ICs) and transistors are electronic components used to hold and connect electrical components in a circuit. They are either permanently mounted on the circuit board or attached with removable wires. While ICs and transistors offer numerous advantages over other types of electronic components, they are not always the best choice for every application. This article discusses the application field and working principle of the 48-3575-16 socket.

Application Field

The 48-3575-16 socket is a high-performance, low-profile, dual-row, low-profile surface mount socket designed for use with high speed, high power ICs. It is ideal for small form factor applications such as cellular phones, digital cameras, and other space-constrained designs. It is also suitable for applications with ESD conditions, as this socket provides a large contact area to ensure no voltage is lost when transistors are inserted.

Working Principle

The 48-3575-16 socket features a bottom surface mount technology to help reduce parasitic elements, minimize the mounting area and improve reliability. The socket utilizes solder-free socket contacts, or LGA pins, for connecting to IC contacts. The contact layout eliminates gaps between pins, reducing leakage and providing superior thermal performance. The socket also features a thermal sink plate integrated with the socket contacts to reduce hot spots during operation. The contact spring and conductive plate are designed to provide a secure connection and excellent signal integrity.

Conclusion

The 48-3575-16 socket is an ideal choice for high performance, low profile applications. It allows for efficient heat dissipation, strong contact retention, and excellent signal integrity and reliability. The low profile and high contact areas also make it ideal for space-constrained designs. Its solder-free socket contacts provide quick and simple assembly, eliminating the need for manual soldering or reworks. The 48-3575-16 socket is an excellent choice for use with high speed, high power ICs and transistors.

The specific data is subject to PDF, and the above content is for reference

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