
Allicdata Part #: | 5-1437532-0-ND |
Manufacturer Part#: |
5-1437532-0 |
Price: | $ 3.19 |
Product Category: | Connectors, Interconnects |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | CONN IC DIP SOCKET 28POS GOLD |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
1700 +: | $ 2.88903 |
Features: | Closed Frame |
Contact Resistance: | 10 mOhm |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.125" (3.18mm) |
Operating Temperature: | -55°C ~ 125°C |
Housing Material: | Polyester |
Contact Material - Post: | Copper Alloy |
Contact Finish Thickness - Post: | -- |
Contact Finish - Post: | Gold |
Pitch - Post: | 0.100" (2.54mm) |
Termination: | Solder |
Series: | 500 |
Mounting Type: | Through Hole |
Contact Material - Mating: | Copper Alloy |
Contact Finish Thickness - Mating: | -- |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 28 (2 x 14) |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Part Status: | Active |
Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Sockets for ICs, Transistors, 5-1437532-0 application field and working principle.
Sockets are now commonplace items on the surface of the integrated circuit (IC) device packages and the boards upon which they mount. While these sockets provide valuable space- and cost savings for several types of applications, it is important to understand the application field and working principles behind their design.
A socket basically acts as a connection between an IC, such as a transistor, and a circuit board that is often soldered onto the device. It does so by providing both contact and heat dissipation from the device. With this combination, the socket transfers signals and power from the integrated circuit to the circuit board. This makes the socket an indispensable component of any device, no matter the application.
The application fields of the socket 5-1437532-0 are varied. It is frequently used in connection with devices that require large current capacities, such as PLCs or microcontrollers. It is also used in connection with devices that require a high-speed operating environment, such as RF ICs and DRAMs. Other types of devices connected to this socket include SRAMs, Flash, MCUs, PLDs, ASICs, and FPGAs.
The 5-1437532-0 socket utilizes metal features to make the electrical contact between the output devices and the board, and this type of contact provides a greater reliability compared to other contact methods. Additionally, the size of the contact interface has been minimized, making it suitable for a wide range of package sizes. Additionally, the high contact reliability of the socket ensures that it can be used in applications that are designed for long life and high electrical performance.
The working principles of 5-1437532-0 socket depend upon the contact structure of the socket. This contact structure consists of four metal contact points which act as the electrical link between the two components, providing both the electrical connection between the board and the IC as well as the heat transfer from the IC to the board. The metal contact points are connected to an external connection pad, which controls the driving and power inputs necessary to drive the device. This external connection pad also provides an interface between the two components, so that any data transmitted between them is correctly interpreted and transmitted.
The 5-1437532-0 socket is an established industry standard, frequently used in combination with PLCs and MCUs, as well as various types of integrated circuit devices. With its industry standard configuration, it can be easily interchanged and is compatible with various types of integrated circuit packages. Furthermore, the socket’s contact technology ensures that it is durable and reliable, providing a long service life and ensuring that it is capable of providing quality data transmission.
The specific data is subject to PDF, and the above content is for reference
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