5-1571552-1 Allicdata Electronics
Allicdata Part #:

5-1571552-1-ND

Manufacturer Part#:

5-1571552-1

Price: $ 3.40
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN IC DIP SOCKET 36POS GOLD
More Detail: N/A
DataSheet: 5-1571552-1 datasheet5-1571552-1 Datasheet/PDF
Quantity: 1000
1300 +: $ 3.08707
Stock 1000Can Ship Immediately
$ 3.4
Specifications
Features: Open Frame
Contact Resistance: 10 mOhm
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Material - Post: Copper
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: 800
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 36 (2 x 18)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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Sockets for ICs, Transistors

Sockets for ICs, transistors and other electronic components are designed to provide greater flexibility and convenience in electronic engineering and prototyping. This type of socket theoretically begins with a simple component assembly, such as a resistor or inductor, which is then expanded into a larger, more complex socket with the addition of additional pins. These pins can be of various lengths and sizes and can include additional legs and pins that allow the integration of other devices, such as capacitors or diodes, into the electronic assembly.

Sockets are typically constructed from non-corrosive materials such as silver, gold, aluminum, and stainless steel, or from conductive materials such as copper and brass. Some models may be coated with an anti-static or anti-corrosive coating to ensure a longer useful life of the components. Many models are designed with a special coating on the interior of the socket that helps to reduce contact resistance and reduce electrical noise.

The socket is designed to be soldered onto a printed circuit board or other substrate. The pins of the socket are arranged in a specific pin pattern that corresponds to the connection of its certain integrated circuit or component. Care is taken to ensure that the pins will fit in the correct holes in the PCB to ensure proper connectivity and signal integrity. For example, in the case of transistors the sockets are designed to match the pin spacing and external body dimensions of the transistor.

The pins of the socket allow electrical signals to pass through it for the respective component to function properly. They are also used to ground the associated components to ensure they are isolated from interference from other electrical signals on the board. This is particularly useful in analog applications where the amount of external electrical influences can significantly alter the performance of the device.

Sockets for ICs have their own special features which makes them more desirable than standard electronic components. They can provide additional features such as improved contact strength, high frequency operation, thermal resistance, solderability and physical/mechanical protection. These features make the socket a valuable tool for designers and engineers of various kinds of electronics.

Sockets for transistors and other components are also manufactured in a much smaller size than the components themselves. This allows smaller, lighter boards to be used in devices that require a minimum of space. Micro-mechanical sockets such as those used in industrial applications, scientific research, and medical equipment are becoming increasingly popular.

The socket has a number of different operating principles used in its construction. Each type of socket is designed to handle a different set of operating parameters. The two main operating principles are packaging and thermal cycling. Packaging is the method of making sure the socket is securely sealed and insulated to protect its components. Thermal cycling is an ongoing process of monitoring the temperature of the socket and circuitry, making sure the power connections remain secure and uninterrupted.

In addition to thermal cycling, many sockets also have the capability to measure the current and offer circuit protection. This prevents overloading of the circuit and avoid any headaches that can result from using the wrong components or incorrectly soldering the pins. This type of application can vary depending on the type of socket, such as Insulated Metal Substrate (IMS) or Ceramic Metal Substrate (CMS) sockets, but the basic principles remain the same.

The sockets for ICs, transistors and other components are an invaluable tool for electronic engineers and prototypers. They allow for greater flexibility when designing circuits for various applications. With the capability to measure current, provide circuit protection, and facilitate thermal cyclic operation, sockets provide engineers with increased control over the operation of their devices.

The specific data is subject to PDF, and the above content is for reference

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