5-1571552-4 Allicdata Electronics
Allicdata Part #:

5-1571552-4-ND

Manufacturer Part#:

5-1571552-4

Price: $ 3.38
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN IC DIP SOCKET 48POS GOLD
More Detail: N/A
DataSheet: 5-1571552-4 datasheet5-1571552-4 Datasheet/PDF
Quantity: 1000
250 +: $ 3.07155
Stock 1000Can Ship Immediately
$ 3.38
Specifications
Features: Open Frame
Contact Resistance: 10 mOhm
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Material - Post: Copper
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: 800
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 48 (2 x 24)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors, specifically 5-1571552-4, are very important components of many electronic circuits. They provide an electrical connection between an IC or transistor and the external components of the circuit. A socket is essentially an electrical connector that allows for electrical signals to be transferred between ICs or transistors and other external components. These sockets are typically used in a variety of applications, including automotive, telecommunications, consumer electronics and much more.

The 5-1571552-4 socket is an example of a type of socket called a BGA (ball grid array) socket. A BGA socket is a type of socket that consists of a number of solder balls, which are arranged in a grid pattern. The number of solder balls on a BGA socket is typically related to the number of pins on the IC or transistor it is intended to be used with. For example, the 5-1571552-4 socket has 126 pins and is intended to be used with a 126-pin IC.

The working principle of a 5-1571552-4 socket is fairly straightforward. The socket’s 126 pins are soldered to the pads on the IC or transistor. The solder balls are then arranged to establish the required electrical connections between the IC or transistor and the external components. This allows signals to be transferred between the integrated circuit and other components connected to the socket.

The applications for a 5-1571552-4 socket are virtually endless. In the automotive industry, these sockets are used primarily for connecting to various sensing and diagnostic devices. They are also used in conjunction with other automotive components, such as microcontrollers, processors, and digital circuits. In the telecommunications and consumer electronics industries, 5-1571552-4 sockets are often used to connect devices such as digital cameras, cell phones, and laptop computers.

In addition to their applications in the automotive, telecommunications, and consumer electronics industries, 5-1571552-4 sockets can also be used in a variety of other applications. For example, they are often used in industrial applications such as robotic control systems and monitoring systems. In the medical industry, they are often used for connecting devices such as blood pressure monitors and heart rate monitors. In the military field, they are used for connecting and controlling equipment such as sensors, communication devices, and navigation devices.

In summary, the 5-1571552-4 socket is an important part of many electronic circuits. Its applications are wide-ranging, and it can be used in a variety of industries. Its working principle is fairly straightforward and involves soldering the socket’s pins to the pads on an IC or transistor and arranging the solder balls to establish the required electrical connections between the IC or transistor and the external components.

The specific data is subject to PDF, and the above content is for reference

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