50-9503-30 Allicdata Electronics
Allicdata Part #:

50-9503-30-ND

Manufacturer Part#:

50-9503-30

Price: $ 10.86
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 50POS GOLD
More Detail: N/A
DataSheet: 50-9503-30 datasheet50-9503-30 Datasheet/PDF
Quantity: 1000
6 +: $ 9.86370
Stock 1000Can Ship Immediately
$ 10.86
Specifications
Termination: Wire Wrap
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.500" (12.70mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 503
Features: Closed Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 50 (2 x 25)
Type: DIP, 0.9" (22.86mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors and other electronic components are a common and important part of an engineer’s toolbox. Emitter-coupled logic (ECL) and integrated circuit (IC) sockets, for example, have been around for decades and are commonly used in electronics applications. Socket selection mainly depends on the type of electronic component being used, and can have a major impact on the performance and reliability of the system.

50-9503-30 is a typical socket for ICs, transistors and other electronic components. It is a through-hole socket constructed using pin contacts, a motherboard PCB footprint, and an IC pedestal. It is designed to provide an interface between a PCB and an IC, transistor or other package, allowing the component to be inserted and removed without damaging either the component or the socket.

The 50-9503-30 application fields are widely seen, including high-end military power supply, aviation products, various instruments calibrator, power amplifier, satellite communication system, laser medical system, optical communication system power amplifier, etc. For these application, the socket 50-9503-30 provide advantages such as high-temperature and high-humidity resistance, EMI protection level, fast signal transmission speed, low insertion force, wide temperature range, and low contact resistance.

The working principle of the 50-9503-30 is based on its internal structure. This socket consists of two main components—a pin contact and an IC pedestal—that connect the IC package and the motherboard PCB footprint. The pin contact is inserted into the IC package, and the IC pedestal is situated underneath. The socket also includes a locking mechanism that helps hold the IC package in place. When the IC package is inserted into the socket, the pin contacts form electrical connections, allowing the device to transfer signals and power. Additionally, the locking mechanism prevents the IC package from being removed during operation, providing additional reliability and performance.

In conclusion, socket 50-9503-30 is a dependable interface device for ICs, transistors and other electronic components, and widely used in many application fields. Its working principle allows for fast signal transmission, high-temperature and humidity resistance, and effective protection from EMI. Ultimately, this socket helps provide reliable performance and durability to any system.

The specific data is subject to PDF, and the above content is for reference

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