50000-5180HLF

Backplane connectors are used in applications where the highest density of interconnects is required for optimal performance. The 50000-5180HLF backplane connector is designed to provide unparalleled interconnect capability in the current data communications industry. It is a high-performance interconnect system with superior signal integrity, high-speed performance, and a low density form factor.

The 50000-5180HLF, or “High-Speed Low-Profile”, backplane connector is designed to provide high-performance interconnectivity, signal integrity, and low-profile packaging in the most densely packed environments. This high-speed connector provides the highest speed transmission rates and performance with the lowest profile form factor. The 50000-5180HLF connector has a single row of contact pairs, which is spaced to provide an optimal number of contacts for faster data transmission and improved signal integrity.

The 50000-5180HLF connector also has a unique profile and mating profile that helps reduce the size and weight of the connection between a circuit board and the backplane. This helps to minimize the number of components needed to create the connection and reduce the overall cost of the system. Additionally, this connector has a low insertion force design, which allows for quick and easy connection between the two devices.

The 50000-5180HLF connector utilizes a combination of high-speed backplane architecture and signal integrity components in order to maximize performance. This high-speed backplane architecture is designed to provide high-speed performance and signal integrity by utilizing optimal circuit paths, connector track lengths, and trace lengths. Additionally, this architecture provides optimal signal integrity by utilizing low-capacitance contact materials. Also, this architecture is designed to minimize EMI and cross-talk, while still providing superior signal integrity and performance.

The 50000-5180HLF connector has been designed with the highest-grade materials in order to ensure the highest degree of performance. This connector is manufactured with a high-strength zinc alloy material that provides superior strength and durability, while also maintaining superior signal integrity and performance. Additionally, this connector features a double-shielding technology that provides protection from EMI and cross-talk. Also, this connector utilizes advanced surface mount technology, which provides excellent PCB integration. Finally, this connector utilizes a triple plating process that ensures highly reliable connections.

In conclusion, the 50000-5180HLF backplane connector is an extremely high-performance interconnect system that offers unparalleled signal integrity, high-speed performance, and a low-density profile. This connector is ideal for the most demanding applications, and provides superior performance and reliability at the lowest cost. Furthermore, this connector is extremely reliable and offers a high degree of compatibility with other backplane systems, ensuring that your system performs to the highest standards.