50006-5102DLF

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 50006-5102DLF is a high-density backplane connector, specially designed for high speed transport and data communication applications. It is capable of supporting up to 12 channels of data signals and diverts these signals to one or two separate backplanes. It can be used in a wide range of applications for connecting multiple boards to the main backplane or even connecting to other backplanes.

The 50006-5102DLF is equipped with a four-position low-profile connector that is designed to provide a secure connection with matching receptacle or board mating connectors. It provides reliable contact with minimal force, allowing for a longer life and easier mating than traditional backplane connectors. It also features a two-piece mating system that is essential for installation in tight or limited space.

The signal contact on the 50006-5102DLF backplane connector is designed to provide reliable transmission at high speeds. It is made from high-performance copper alloy which can provide exceptionally low contact resistance, so as to ensure high-speed data transmission with minimal interference and distortion. The signal contact also has great endurance under high-temperature and overload, resulting in high reliability in long-term operation conditions.

The 50006-5102DLF backplane connector is also designed to provide extra protection and security in highly deflected and difficult environments. It is constructed with anti-shock and anti-vibration features, so it can resist all kinds of temperature variation, humidity, dust and water. Moreover, its compact and slim design makes it easy to install and maintain.

In addition, the 50006-5102DLF has a built-in high-performance contacts structure, which is designed to reduce contact resistance to a minimum and to ensure efficient data transmission even in harsher conditions. It has built-in EMC shielding, which ensures EMI/RFI immunity. The EMC shielding also reduces cross talk and improves the signal integrity.

In order to stay ahead of the competition in today\'s fast-paced environment, the 50006-5102DLF backplane connector is also designed with reliable thermal management features. It features a modified dip joint that provides a high level of thermal performance while still maintaining its excellent electrical and mechanical performance. This feature, coupled with its wide temperature working range, makes it suitable for high-speed transmissions in a wide range of applications.

To conclude, the 50006-5102DLF is an innovative backplane connector designed for high-speed transport and data communication applications. It features a four-position low-profile connector, EMC shielding, excellent contact resistance, and a two-piece mating system. Furthermore, its thermal management features, such as modified dip joint and wide working temperature range, increases its performance and reliability. All these features make it ideal for connecting multiple boards to the main backplane or even connecting to other backplanes.

The specific data is subject to PDF, and the above content is for reference