50009-1064CLF Allicdata Electronics
Allicdata Part #:

50009-1064CLF-ND

Manufacturer Part#:

50009-1064CLF

Price: $ 10.56
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: 4R VER HDR PF 0GP
More Detail: N/A
DataSheet: 50009-1064CLF datasheet50009-1064CLF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
50 +: $ 9.59539
Stock 1000Can Ship Immediately
$ 10.56
Specifications
Series: HPC™
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: Daughtercard
Connector Type: Header, Male Pins
Connector Style: High Density (HDC, HDI, HPC)
Number of Positions: 64
Number of Positions Loaded: All
Pitch: 0.100" (2.54mm)
Number of Rows: 4
Number of Columns: 16
Mounting Type: Through Hole
Termination: Press-Fit
Contact Layout, Typical: --
Features: Mating Guide
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Black
Current Rating: --
Material Flammability Rating: UL94 V-0
Operating Temperature: --
Voltage Rating: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors are specialized electronic connectors used to join the backplane of a hardware device or system to the other components. The 50009-1064CLF backplane connector is a type of connector designed for the most demanding applications. This connector provides improved performance while being easier to use and install, making it the ideal choice for a variety of demanding applications.

The 50009-1064CLF is designed to provide high-speed signal transmission, robust signal retention, and superior mechanical and electrical properties for a wide range of applications. This backplane connector is ideally suited for devices and systems requiring high speed data transfer, such as enterprise servers and telecom equipment. It is also ideal for harsh environments, offering superior performance in extreme temperature ranges and low shock and vibration resistance.

The 50009-1064CLF is designed to maintain signal integrity despite the challenging conditions of the application environment. This connector features superior thermal performance, allowing it to be used in a wide range of temperatures. It also offers improved design flexibility, allowing for a variety of connection options, from simple through-hole connections to multi-pin configurations. This backplane connector also offers advanced EMC shielding, which helps protect the system from electromagnetic interference.

The 50009-1064CLF also offers superior performance and reliability due to its unique design. This connector is equipped with a shielded pin guard that helps maintain better connection quality and signal integrity. The pin guard helps minimize capacitive coupling, allowing for improved signal velocity. In addition, the connector features high-strength ribs and robust compression contacts, which help ensure reliable connections and reduce the risk of mechanical failure.

The working principle of the 50009-1064CLF backplane connector is based on the laws of electromagnetism. This connector uses electromagnetic force to connect the pins of the backplane to the components of the device or system. The connection between pins is maintained via a secure metal coupling which is established by the magnetic fields generated by the pins. This connection allows for the efficient and reliable transmission of signals between the backplane and the other components.

The 50009-1064CLF backplane connector is an ideal choice for a wide range of demanding applications. This connector provides improved performance, enhanced EMC shielding and robust signal integrity. Its unique design also ensures reliable connections and superior thermal performance. The working principle of the 50009-1064CLF backplane connector is based on the laws of electromagnetism, which allow for a secure and efficient signal transmission between the backplane and the other components.

The specific data is subject to PDF, and the above content is for reference

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