50009-5180CLF Allicdata Electronics
Allicdata Part #:

50009-5180CLF-ND

Manufacturer Part#:

50009-5180CLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN HEADER 4 ROW VERT PRESS FIT
More Detail: N/A
DataSheet: 50009-5180CLF datasheet50009-5180CLF Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
0 +: $ 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 45
Voltage Rating: --
Operating Temperature: --
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: Black
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold or Gold, GXT™
Features: Mating Guide
Contact Layout, Typical: --
Termination: Press-Fit
Mounting Type: Through Hole
Series: HPC™
Number of Rows: 4
Pitch: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 180
Connector Style: High Density (HDC, HDI, HPC)
Connector Type: Header, Male Pins
Connector Usage: Daughtercard
Moisture Sensitivity Level (MSL): --
Part Status: Preliminary
Lead Free Status / RoHS Status: --
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

  • Introduction
The 50009-5180CLF is a specialized backplane connector developed by Amphenol. It is designed to provide reliable high-speed connectivity between integrated circuits and other devices in a wide range of applications such as high-speed boards and fast interconnect systems. This backplane connector has 12, 16, and 24 contacts and is rated up to 30,000 cycles. Its features include low insertion loss, high isolation, and low crosstalk, making it suitable for a wide range of applications. In addition, this connector has an isolating shuttle cap that provides additional protection from potential shorts.
  • Application Field
The 50009-5180CLF backplane connector is primarily used in high-speed connection systems and ultra-high speed boards. Its high reliability, low insertion loss, and low crosstalk make it an ideal choice for applications involving critical data or signal transmission. For example, it is used in the connection of high-speed memory buses, P6-3.0, P6-3.3, P5-1.5, Q3.3, and Q5.0 buses. In addition, it is also used in the connection of high-speed I/O ports such as USB 2.0, Firewire, and wireless networks.The 50009-5180CLF backplane connector can also be used in applications requiring isolation, such as those involving FPGA integration or high voltage differential signals. Its isolation shuttle cap provides extra protection against electrostatic discharge and other potential shorts, ensuring reliable performance in such applications.
  • Working Principle
The 50009-5180CLF backplane connector is designed to provide reliable high-speed connection. Its construction includes a high-quality contact terminal, which is surrounded by a shielding cup. These contact terminals provide low insertion loss and high isolation levels, as well as low crosstalk and excellent return loss. The shielding cup is designed to minimize the emission of electromagnetic radiation and reduce the incidence of interference.The isolating shuttle cap offers additional protection from shorts and electrostatic discharge. The isolating shuttle cap is designed to slide up and down on the contact terminal, thus ensuring that the connector does not become shorted out. The caps also ensure that the connector does not touch the component, ensuring that the connector is well protected from sudden static discharges.The 50009-5180CLF backplane connector is rated up to 30,000 cycles and has a wide range of contact force levels. This ensures reliable operation in high-speed applications where the connector needs to be used and reused frequently.
  • Conclusion
In conclusion, the 50009-5180CLF backplane connector is suitable for a wide range of data and signal transmission applications, including high-speed memory buses, P6-3.0, P6-3.3, P5-1.5, Q3.3, and Q5.0 buses, as well as high-speed I/O ports such as USB 2.0, Firewire, and wireless networks. Its construction provides reliable connection, low insertion loss, high isolation, and low crosstalk. In addition, its isolating shuttle cap provides extra protection from potential shorts and electrostatic discharge.

The specific data is subject to PDF, and the above content is for reference

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