50294-1030HLF Allicdata Electronics
Allicdata Part #:

50294-1030HLF-ND

Manufacturer Part#:

50294-1030HLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN RECEPT 3 ROW RA SOLDER
More Detail: N/A
DataSheet: 50294-1030HLF datasheet50294-1030HLF Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
0 +: $ 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 10
Voltage Rating: --
Operating Temperature: --
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: --
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: Mating Guide
Contact Layout, Typical: --
Termination: Solder
Mounting Type: Through Hole, Right Angle
Series: HPC™
Number of Rows: 3
Pitch: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 30
Connector Style: High Density (HDC, HDI, HPC)
Connector Type: Receptacle, Female Sockets
Connector Usage: Daughtercard
Moisture Sensitivity Level (MSL): --
Part Status: Preliminary
Lead Free Status / RoHS Status: --
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

50294-1030HLF Backplane Connectors are designed to be specialized connectors for connecting multiple systems in a rack, DIN rail or wall-mounted operation. The connectors are the result of operational reliability in harsh environment such as military and aerospace applications.

Application Field

Due to its wide range of applications, 50294-1030HLF Backplane Connectors are designed for operation in severe conditions such as high temperature, high shock, high vibration, wide range of pressure, dust, dirt and humidity. Additionally, the input/output characteristics of the connector allow full support for vast selection of protocols such as SCSI, DVI, Serial ATA, Serial Attached SCSI, and is suitable for usage in high frequency interface cards. The flexibility of the connector allows for customized pinouts and is suitable for use in both stand-alone as well as multiplexed systems.

Working Principle

The 50294-1030HLF Backplane Connectors use a combination of robust pins and contacts manufactured from metals and alloys suitable for the application field. The pin contact is a press-fit connection, where the contact is inserted into the backplane connector housing. The contacts are held in place by means of special lugs which are coupled with the backplane connector housing. The pins contact the conductive devices after the insertion of the contact into the backplane connector housing.

The contacts are made of quality materials and are capable of wide operating temperatures and suitable for high frequency data transmission. The data signals are transmitted through the contact system via signal contacts between the pin and contact elements. The contacts are inserted into the housing of the backplane connector via a press-fit, and are held firmly in place.

The 50294-1030HLF Backplane Connector design ensures that the contact elements provide reliable and corrosion-free data connection signal paths. The backplane connector features a robust construction of molded Techno Polymer with a soft touch finish, designed to reduce the risk of shock and vibration. The connector has an optional interface lock mechanism to prevent the connectors from accidentally being disconnected from the system.

Conclusion

The 50294-1030HLF Backplane Connectors provide a reliable and flexible solution to connecting multiple systems in a wide variety of applications. The connectors provide a robust construction to ensure reliability and features a press-fit contact system with a optional locking mechanism. The contacts used in the connector system are designed for usage in high frequency data transmission and are corrosion free. The contacts are suitable for use in extreme conditions such as high temperature, high shock, high vibration, wide range of pressure, dust, dirt and humidity.

The specific data is subject to PDF, and the above content is for reference

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