510-87-175-14-001101 Allicdata Electronics
Allicdata Part #:

510-87-175-14-001101-ND

Manufacturer Part#:

510-87-175-14-001101

Price: $ 4.84
Product Category:

Connectors, Interconnects

Manufacturer: Preci-Dip
Short Description: CONN SOCKET PGA 175POS GOLD
More Detail: N/A
DataSheet: 510-87-175-14-001101 datasheet510-87-175-14-001101 Datasheet/PDF
Quantity: 1000
75 +: $ 4.40597
Stock 1000Can Ship Immediately
$ 4.84
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: --
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 510
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: Flash
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 175 (14 x 14)
Type: PGA
Part Status: Active
Packaging: Bulk 
Description

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Sockets for ICs and transistors are a common type of electronic component. In its simplest form, a socket for ICs and transistors is a small, low-cost piece of plastic or metal that fits snugly into a printed circuit board (PCB). The socket allows the components to be easily plugged into the board during the assembly process. Socket for ICs and transistors provide an easy way to mount and connect components, reducing the amount of wiring and simplifying assembly and re-work.

The 510-87-175-14-001101 application field and working principles of these sockets for ICs and transistors refer to the soldering requirements for connecting multiple interconnections between the various components. These interconnections can be either through-hole soldering or surface mount soldering. The purpose of the application field and working principles is to ensure that the proper connections can be made with a minimum number of solder joints. Connections between components are typically completed by using a soldering iron to heat the end of the lead and then applying solder in between the two (2) leads.

The soldering wire and flux are also important components for creating the precision interconnections found with sockets for ICs and transistors. The solder wire should be of high quality to ensure that it can provide a reliable electrical connection. The solder must also have the proper plumbing so that it can connect all the components properly without shorting any of them. Once this is accomplished, the flux should be applied. Flux helps the solder adhere to the board better and prevents the formation of any solder voids.

Cleaning of the area before soldering is an important part of ensuring that the solder creates a good electrical connection. Any foreign material such as dust, dirt, oil, or fingerprints must be removed from the area before the solder is applied. This can be done by using a brush, a cloth, or a vacuum cleaner with a brush attachment.

After the soldering wire is applied to the socket for ICs and transistors, the soldering iron must be heated to the correct temperature for soldering. After the specified temperature is reached, the solder can be carefully applied to the area being soldered. After a good connection is made, the soldering iron should be removed and the connection tested with a multimeter to ensure the proper connections have been made.

Socket for ICs and transistors require a reliable connection in order to ensure the proper data transfer and protection for the electronic devices. Utilizing the proper soldering procedure as outlined in the 510-87-175-14-001101 application field and working principles will help guarantee a proper connection and minimize the likelihood of any damage to the components. This not only eliminates the risk of potential data errors or damage, but also helps keep the cost of parts and labor costs low.

The specific data is subject to PDF, and the above content is for reference

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