510-87-180-18-111101 Allicdata Electronics
Allicdata Part #:

510-87-180-18-111101-ND

Manufacturer Part#:

510-87-180-18-111101

Price: $ 4.73
Product Category:

Connectors, Interconnects

Manufacturer: Preci-Dip
Short Description: CONN SOCKET PGA 180POS GOLD
More Detail: N/A
DataSheet: 510-87-180-18-111101 datasheet510-87-180-18-111101 Datasheet/PDF
Quantity: 1000
77 +: $ 4.30527
Stock 1000Can Ship Immediately
$ 4.73
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: --
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 510
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: Flash
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 180 (18 x 18)
Type: PGA
Part Status: Active
Packaging: Bulk 
Description

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Sockets for ICs, Transistors have come a long way to aid tech-savvy users, making it easier to handle chips, transistors, relays and other components. One of the newer developments in this area is the 510-87-180-18-111101 socket. This type of socket has the ability to handle a wide variety of ICs, transistors and other components. It is suitable for both surface mount and through-hole types.

The 510-87-180-18-111101 socket is made up of a unique design. It consists of four layers with an inner and outer metal shield. This shield prevents electrostatic interference and makes it more reliable for surface mount devices. The inner layer is typically made of an epoxy-filled boron nitride ceramic material. This provides a highly efficient thermal interface to the PCB surface.

The configuration of the 510-87-180-18-111101 socket is quite simple. It has two rows of 20 pins which can hold both surface mount and through-hole components. This allows for efficient thermal dissipation and makes it ideal for power switching devices. Each pin has a metal spring contact, which allows for an improved contact force.

In order to mount the 510-87-180-18-111101 socket, it is necessary to use an appropriately sized PCB. The pins must be inserted into the appropriate holes, and a thermal pad should be placed in between the two layers for improved thermal dissipation. The PCB should be soldered at the required temperature depending on the size of the socket.

The 510-87-180-18-111101 socket is suitable for a wide variety of applications. It is suitable for power switching, signal routing, communications, RFIDs, display control, etc. It is also suitable for handling ICs, transistors and other surface mount components. In addition, it is suitable for multi-chip modules.

The working principle of the 510-87-180-18-111101 socket is simple yet effective. It is designed to provide a reliable connection between the boards and components. The inner layer has an epoxy-filled boron nitride ceramic material which provides a highly efficient thermal interface to the PCB surface. The pins are connected to the board through a metal spring contact. This provides a more reliable contact force. The pins are then connected to the component via a solder joint.

The 510-87-180-18-111101 socket is an ideal choice for many users, providing a reliable connection between the boards and components. This type of socket is suitable for power switching, signal routing, communications, RFIDs, display control, etc. It is also suitable for handling ICs, transistors and other surface mount components. The pins have metal spring contacts which allow for an improved contact force and efficient thermal dissipation. The inner layer of the socket is composed of an epoxy-filled boron nitride ceramic material. This makes it more reliable for surface mount devices. Due to its versatility and reliability, the 510-87-180-18-111101 socket has become a popular choice for many applications.

The specific data is subject to PDF, and the above content is for reference

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