516-020-520-502 Allicdata Electronics
Allicdata Part #:

516-020-520-502-ND

Manufacturer Part#:

516-020-520-502

Price: $ 14.09
Product Category:

Connectors, Interconnects

Manufacturer: EDAC Inc.
Short Description: RACK AND PANEL CONNECTOR
More Detail: N/A
DataSheet: 516-020-520-502 datasheet516-020-520-502 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
25 +: $ 12.81170
Stock 1000Can Ship Immediately
$ 14.09
Specifications
Series: 516
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Plug, Hermaphroditic Contacts
Connector Style: Rack and Panel
Number of Positions: 20
Number of Positions Loaded: All
Pitch: 0.150" (3.81mm)
Number of Rows: 4
Number of Columns: --
Mounting Type: Panel Mount
Termination: Solder
Contact Layout, Typical: --
Features: Jackscrew Socket, Mating Guide
Contact Finish: Gold
Contact Finish Thickness: --
Color: Green
Current Rating: 8.5A
Material Flammability Rating: UL94 V-0
Operating Temperature: -65°C ~ 125°C
Voltage Rating: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to 516-020-520-502 Backplane Connectors - Specialized

Backplane connectors are specialized devices designed for connecting circuit boards together. The 516-020-520-502 is a backplane connector system designed to provide high-speed, low-level signal transmission between adjacent circuit boards. It is often used where conventional interconnects cannot provide the necessary signal quality or current carrying capability.

Main Features and Benefits of 516-020-520-502

The design of the 516-020-520-502 ensures high performance and reliability. It provides superior contact resistance, current carrying capabilities, and signal integrity. It also features a very low-profile design, which allows installation even in confined spaces. The connectors feature gold-plated contacts for improved contact reliability and thermal and fatigue properties.The 516-020-520-502 comes with a wide range of features and benefits, such as;

  • Robust construction with reliable contact performance and a wide range of mounting options
  • Low-profile design for reduced space requirements
  • Gold-plated contacts for improved contact reliability, thermal and fatigue properties
  • High-speed signal transfer for improved performance
  • High current-carrying capability for reliable operation
  • Compatible with a variety of circuit board materials

Application and Working Principle of 516-020-520-502

The 516-020-520-502 backplane connector is primarily used in high speed, low-level signal applications. It is ideal for applications such as embedded systems, industrial automation, robotics, and telecommunications.

The 516-020-520-502 system is composed of a housing and two mating connectors. The housing has a series of integrated pins that are connected to the trace on the circuit board. When the mating connectors are attached, the pins on the housing make contact with the traces on the board, allowing a high-speed signal connection. The pins on the housing are also gold-plated to ensure a reliable connection and reduce the risk of signal degradation.

The current-carrying capability of the 516-020-520-502 is also improved by the use of multiple pins and contact areas on the housing. The larger contact areas reduce the risk of contact resistance. The system also includes a special locking mechanism to ensure that the mating connectors are properly aligned during installation.

Conclusion

The 516-020-520-502 backplane connector is a reliable and cost-effective solution for applications requiring high-speed, low-level signal transmission between adjacent circuit boards. It is easy to install, highly reliable, and provides superior contact resistance, current-carrying capability, and signal integrity. It is the ideal solution for embedded systems, industrial automation, robotics, and telecommunications.

The specific data is subject to PDF, and the above content is for reference

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