517-87-321-19-121111 Allicdata Electronics
Allicdata Part #:

517-87-321-19-121111-ND

Manufacturer Part#:

517-87-321-19-121111

Price: $ 11.38
Product Category:

Connectors, Interconnects

Manufacturer: Preci-Dip
Short Description: CONN SOCKET PGA 321POS GOLD
More Detail: N/A
DataSheet: 517-87-321-19-121111 datasheet517-87-321-19-121111 Datasheet/PDF
Quantity: 1000
30 +: $ 10.33540
Stock 1000Can Ship Immediately
$ 11.38
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: --
Contact Finish - Post: Tin
Pitch - Post: 0.050" (1.27mm)
Series: 517
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: Flash
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Positions or Pins (Grid): 321 (19 x 19)
Type: PGA
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors are incredibly versatile components with a wide range of applications. The 517-87-321-19-121111 socket is no exception, with its unique features making it viable in a variety of areas.

The name of this socket reveals its base material: copper. It is designed to operate between -50 and +250 degrees Celsius and its mechanical strength makes it one of the sturdiest sockets on the market. The 517-87-321-19-121111 socket also incorporates integrated slotted methods for easier installation.

This socket finds itself in a variety of industrial applications. It is used as an interface between devices such as transistors and ICs and to connect these components to higher voltage sources. It is also used to transfer signals from one end to the other, meaning it can also be used to connect transistors in parallel.

The 517-87-321-19-121111 socket also has many other applications where it competes with other types of sockets. Electronic systems that require smaller size components find themselves greatly aided by the 517-87-321-19-121111 socket. Its unique size and form factor make it easily fit into tight spaces, making it ideal for portable electronics.

The 517-87-321-19-121111 socket also makes it possible to stack components together in order to increase the current rating of a system. This is done by connecting multiple transistors in parallel at one end of the socket, and in series at the other.

The 517-87-321-19-121111 socket is extremely important in circuit board assembly as well. The 517-87-321-19-121111 socket is designed to transfer and hold signals between components, meaning it can be used to route several components in one circuit board. This is especially useful in complex systems where components need to be connected in a specific pattern.

The working principle of the 517-87-321-19-121111 socket is based on providing a segment of metal in which holes are punched. This segment of metal is then joined together at either end at a later point, and soldering these ends will connect all components located within the segment.

The pins from the transistors and ICs fit into the punched holes and are connected to the metal segment using solder. The connection between the pins and the segment creates a low impedance electrical path between the components, allowing them to transfer signals with minimal interference.

The 517-87-321-19-121111 socket is highly efficient and cost effective. Due to its three-in-one design, it can easily be used in a variety of applications such as connecting ICs and transistors to higher voltage sources, to transfer signals between components, and in complex circuit board assemblies. This makes it a great choice for engineers and technicians looking for a reliable and easy-to-use solution for their projects.

The specific data is subject to PDF, and the above content is for reference

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