51730-216LF

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The 51730-216LF is an area array interconnect used for high density applications. It provides up to 216 pins in a 0.8mm pitch. This connector is designed for space-constrained applications that require an extremely high connection density. It has a low profile, lightweight construction, and is highly reliable and rugged. It is also designed to provide a low profile solution for high speed interconnects.

The 51730-216LF is a specialized backplane connector designed specifically for space-constrained applications. It utilizes a unique design that allows it to provide a high density connection without sacrificing space. The connector has a slim profile of only 3.7mm, which is up to 40% smaller than traditional connectors, and has an advanced shielding system to protect against EMI. The surface mount configuration allows for easy integration into boards and systems with limited space.

The 51730-216LF is designed for applications that require high speed data transfer. It has a data rate of up to 25Gbps, and it can support up to 10 gigabit Ethernet ports. It has a robust contact configuration that offers reliable electrical and mechanical performance, even in environments with high temperature and vibration. In addition, the connector has a wide operating temperature range of -40°C to +85°C, making it suitable for industrial and automotive applications.

The 51730-216LF utilizes a unique design for its working principle. It utilizes a vertical signal connector that allows the electrical signals to be routed directly to the contact elements. This eliminates the need for a separate trace routing layer, which reduces the overall connector size and improves signal integrity. The contact elements are designed to ensure a reliable electrical connection and long-term, low-power performance even in extreme temperature and vibration conditions.

The 51730-216LF is an ideal solution for space-constrained applications that require a reliable, high-speed data connection. It features a slim design, advanced shielding, and reliable electrical and mechanical performance. In addition, its wide range of operating temperature and its low profile make it suitable for a wide range of applications, including automotive, industrial, medical, consumer electronics, networking, and wireless. Its reliable electrical and mechanical performance make it a reliable and robust solution for high-speed data transfer.

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